Advanced Micro Devices Corporation

Mustansir M Pratapgarhwala

Amitabh Mehra

Scott E Swanstrom

Anil Harwani

William R Alverson

Grant E Ley

Jerry A Ahrens

Christopher M Jaggers

Michael J Austin

Sukesh Shenoy

Robert Edward Radke

Christopher M Helberg

An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. Each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.

Component cooler for a computing device

Automatic part testing includes: booting a part under testing into a first operating environment; executing, via the first operating environment, one or more test patterns on the part; performing a comparison between one or more observed characteristics associated with the one or more test patterns and one or more expected characteristics; and modifying one or more operational parameters of a central processing unit of the part based on the comparison.

Automatic part testing

Growing community of inventors

Austin, TX, United States of America

Mustansir M Pratapgarhwala