Intel Corporation

Mustafa H Haswarey

Thomas A Boyd

Rolf Laido

Ming-Chen Chang

Divya Swamy Bandaru

Eric W Buddrius

Shelby A Ferguson

Russell S Aoki

Ralph V Miele

Anthony P Valpiani

Andrew Larson

Bijoyraj Sahu

Eric Dwight McAfee

Craig J Jahne

Kevin Ceurter

Evan A Chenelly

Ridvan A Sahan

Rahima K Mohammed

Daniel Neumann

Jorge Contreras Perez

Aslam H Haswarey

Rachel Taylor

Praneetha Kolla

Whitten Schulz

A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions

A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.

Method and apparatus for detaching a microprocessor from a heat sink

A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets

Embodiments include a carrier assembly, a method of forming the carrier assembly, and a semiconductor package. A carrier assembly includes a socket on a package substrate, and a carrier having a transparent material, a first opening, first alignment openings, and barbs. The carrier assembly also includes an electronic device embedded into the first opening of carrier and coupled to the carrier by barbs. The carrier assembly further includes a bolster plate on the package substrate, the bolster plate having a second opening, loading studs, and second alignment openings, and the second opening surrounds the socket. Each loading stud is positioned on a corner edge of the bolster plate. The carrier assembly may align the first alignment openings above the second alignment openings to couple the carrier onto the bolster plate. The carrier assembly may include a heat sink disposed on the electronic device, carrier, and bolster plate.

All-inclusive CPU carrier that enable automation and tool free operation at low-cost while improving thermal performance

Embodiments may relate to a cover for a socket of a computing device. The cover may include a cover piece and a locking mechanism attached to the cover piece by a hinge. The locking mechanism, when in a locked position, may removably secure the cover to a bolster such that the cover piece overlays the socket. Other embodiments may be described and/or claimed.

Socket cover

The present description relates to the field of microelectronic device retention mechanisms and, more particularly, to a quick release retention mechanism including a base plate, a load plate and a biasing mechanism adapted to apply a desired load and to allow rapid insertion and extraction of microelectronic devices from sockets.

Quick release retention mechanism for socketed microelectronic devices

Growing community of inventors

Hillsboro, OR, United States of America

Mustafa H Haswarey