Memx, Inc.

Sandia Corporation

Other

The United States of America As Represented by the Department of Energy

Murray Steven Rodgers

Samuel Lee Miller

Stephen M Barnes

Jeffry Joseph Sniegowski

Paul Jackson McWhorter

Norman Frank Smith

William Michael Miller

Jeffrey J Sniegowski

Daniel P Aeschliman

A cutting blade () having a cutting edge () defined by an intersection of a first cutting edge surface () and a second cutting edge surface () is disclosed. The angle between the first cutting edge surface () and the second cutting edge surface () defines a blade angle (&#x3b8;). The blade () may be fabricated from a wafer () by an anisotropic etch. An upper surface () of the wafer () is defined by a first set of 3 Miller indices, where at least one individual Miller index of this first set has an absolute value greater than 3. A top surface () of the blade () is defined by part of the upper surface () of the wafer (). The anisotropic etch proceeds until reaching a particular crystallographic plane to define the first cutting edge surface (). Having the top surface () of the blade () defined by the noted set of 3 Miller indices increases the potential that a blade angle (&#x3b8;) of a desired magnitude may be realized.

Microkeratome blade with arbitrary blade angle

A microelectromechanical system is disclosed that constrains the direction of a force acting on a first load, where the force originates from the interaction of the first load and a second load. In particular, the direction of a force acting on the first load is caused to be substantially parallel with a motion of the first load. This force direction constraint is achieved by a force isolator microstructure that contains no rubbing or contacting surfaces. Various embodiments of structures/methods to achieve this force direction constraint using a force isolator microstructure are disclosed.

Microelectromechanical system with non-collinear force compensation

Multiple cutting blades () are fabricated from a wafer (). This wafer () is disposed on a blade handle mounting fixture () such that a blade handle () maybe mounted on each of the individual blades (). A cutting edge () of each blade () is maintained in spaced relation to the fixture () as these blade handles () are being mounted. Thereafter, the wafer () is transferred to a blade separation fixture (). Each bladeis suspended above the fixture (). An appropriate force is transmitted to the individual blades () to separate the same from the wafer (). Separation preferably occurs before the blade () contacts the fixture (). Thereafter, the blade () in effect pivots into an inclined position where its cutting edge () projects at least generally upwardly. Preferably, at no time does the cutting edge () of any blade () contact either the blade handle mounting fixture () or the blade separation fixture ().

Multi-fixture assembly of cutting tools

The present invention generally relates to a die perimeter region of a die having a microelectromechanical assembly fabricated thereon. This die perimeter region may be configured to facilitate electrically interconnecting adjacent die on a wafer. Moreover, this die perimeter region may be configured to facilitate separating the die from a wafer.

Method for making a multi-die chip

Self-shadowed microelectromechanical structures such as self-shadowed bond pads, fuses and compliant members and a method of fabricating self-shadowing microelectromechanical structures that anticipate and accommodate blanket metalization process steps are disclosed. In one embodiment, a self-shadowed bond pad () configured for shadowing an exposed end (A) of a shielded interconnect line () connected to the bond pad () from undesired metalization during a metalization fabrication process step includes electrically connected overlaying first, second and third bond pad areas () patterned from respective first, second and third layers () of material deposited on a substrate (). The exposed end (A) of the interconnect line () abuts an edge of the first bond pad area (). The third bond pad area () includes at least one tab portion () extending laterally from an edge of the third bond pad area () to shadow an area on the substrate () including the exposed end (A) of the interconnect line () abutting the edge of the first bond pad area ().

Self-shadowing MEM structures

The present invention is generally directed to a method and assembly for supporting an actuation apparatus (e.g. a movable electrostatic comb) of a microelectromechanical (MEM) system. A suspension assembly of the present invention generally resists actuation forces inherent to electrostatically controlled MEM systems by utilizing an opposingly-directed non-linear tensile force. This can be accomplished by utilizing a suspension assembly of the invention including a longitudinal center beam and a plurality of first and second lateral beams extending out from lateral sides of the center beam. When the center beam of the suspension assembly is drawn in a first direction due to the actuation force(s), either or both of the plurality of first lateral beams and the plurality of second lateral beams are stretched to exert a non-linear tensile force having a force vector component generally oriented in a second direction generally opposite the first direction.

Non-linear actuator suspension for microelectromechanical systems

A particle filter for microelectromechanical systems is provided that includes a particle trap formed on a substrate material. The particle trap includes an array of multidimensional geometric structures in an adjacent relationship. The geometric structures further define a plurality of multidimensional voids therebetween for trapping particles therein. The individual multidimensional geometric structures are formed by a plurality of vertically interconnected geometric shapes to define different configurations of voids between the adjacent geometric structures. In one embodiment of the filter system, an electrical bias is applied to the array of multidimensional geometric structures to facilitate attracting and trapping of particles in the filter.

Particle filter for microelectromechanical systems

A microelectromechanical system is disclosed that uses a stiff tether between an actuator assembly and a lever that is interconnected with an appropriate substrate such that a first end of the lever may move relative to the substrate, depending upon the direction of motion of the actuator assembly. Any appropriate load may be interconnected with the lever, including a mirror for any optical application.

Method for operating a microelectromechanical system using a stiff coupling

The present invention provides a MEM system () having a platform () that is both elevatable from the substrate () on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (). In one embodiment, the MEM system () includes the platform (), a pair of A-frame structures (), and two pairs of actuators () formed on the substrate (). Ends (A) of rigid members () extending from apexes (A) of the A-frame structures () are attached to the platform () by compliant members (A,B). The platform () is also attached to the substrate () by a compliant member (C). The A-frame structures () are separately pivotable about bases (B) thereof. Each pair of actuators () is coupled through a yoke () and displacement multiplier () to one of the A-frame structures () and is separately operable to effect pivoting of the A-frame structures () with respect to the substrate () by equal or unequal angular amounts. Upon pivoting, the A-frame structures () act as lever arms to both lift the platform () and tilt the platform () with respect to the substrate () with at least one degree of freedom. Since the platform () lifts up from the surface of the substrate (), it may be tilted at large angles with respect to the substrate ().

Microelectromechnical system for tilting a platform

A microelectromechanical system is disclosed that provides amplified movement without requiring the use of a displacement multiplier. Generally, a lever or the like is interconnected with a substrate on which the system is fabricated at a first location, while a free end of the lever is able to move relative to the substrate, typically at least generally about the first location. One or more actuators are movably interconnected with the substrate, and in turn are interconnected with the lever at a location that is somewhere between the free end and the first location. The lever may be configured to move at least generally away from the substrate upon movement of the actuator in one direction, at least generally toward the substrate upon movement of the actuator in another direction, or in any direction and in any manner. The movement of the 'free' end of the lever may be used to perform any function, including lifting/pivoting a mirror away from/relative to the substrate.

Microelectromechanical system and method for producing displacement multiplication

A multi-level shielded multi-conductor interconnect bus for use in interconnecting MEM devices with control signal sources and a method of fabricating a multi-level shielded multi-conductor interconnect bus are disclosed. In one embodiment, a multi-level shielded interconnect bus (A) formed on a substrate () includes first and second level electrically conductive lines () arranged in sets of one, two or more conductive lines between first and second level electrically conductive shield walls (). The first and second level electrically conductive lines () are surrounded by various layers of dielectric material (). A first level electrically conductive shield () overlies the first level electrically conductive lines () and shield walls (). A second level electrically conductive shield () overlies the second level electrically conductive lines () and shield walls ().

Multi-level shielded multi-conductor interconnect bus for MEMS

The present invention provides a MEM system ( ) having a platform ( ) that is both elevatable from the substrate ( ) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate ( ). In one embodiment, the MEM system ( ) includes the platform ( ), a pair of A-frame structures ( ), and two pairs of actuators ( ) formed on the substrate ( ). Ends ( A) of rigid members ( ) extending from apexes ( A) of the A-frame structures ( ) are attached to the platform ( ) by compliant members ( A, B). The platform ( ) is also attached to the substrate ( ) by a compliant member ( C). The A-frame structures ( ) are separately pivotable about bases ( B) thereof. Each pair of actuators ( ) is coupled through a yoke ( ) and displacement multiplier ( ) to one of the A-frame structures ( ) and is separately operable to effect pivoting of the A-frame structures ( ) with respect to the substrate ( ) by equal or unequal angular amounts. Upon pivoting, the A-frame structures ( ) act as lever arms to both lift the platform ( ) and tilt the platform ( ) with respect to the substrate ( ) with at least one degree of freedom. Since the platform ( ) lifts up from the surface of the substrate ( ), it may be tilted at large angles with respect to the substrate ( ).

Microelectromechanical system for tilting a platform

Microelectromechanical system with stiff coupling

Self-shadowed microelectromechanical structures such as self-shadowed bond pads, fuses and compliant members and a method of fabricating self-shadowing microelectromechanical structures that anticipate and accommodate blanket metalization process steps are disclosed. In one embodiment, a self-shadowed bond pad ( ) configured for shadowing an exposed end ( A) of a shielded interconnect line ( ) connected to the bond pad ( ) from undesired metalization during a metalization fabrication process step includes electrically connected overlaying first, second and third bond pad areas ( ) patterned from respective first, second and third layers ( ) of material deposited on a substrate ( ). The exposed end ( A) of the interconnect line ( ) abuts an edge of the first bond pad area ( ). The third bond pad area ( ) includes at least one tab portion ( ) extending laterally from an edge of the third bond pad area ( ) to shadow an area on the substrate ( ) including the exposed end ( A) of the interconnect line ( ) abutting the edge of the first bond pad area ( ).

The present invention is generally directed to a method and assembly for elevating and supporting a microstructure of a MEM system generally by engaging a positioning system of the MEM system with a first elevator lifter. The MEM system generally includes a first microstructure (such as a mirror) disposed in vertically spaced relation to a substrate. The positioning system generally includes an actuator assembly movably interconnected with the substrate, an elevator pivotally interconnected with the substrate and further interconnected with the microstructure, and a tether interconnecting the actuator assembly and the elevator. The first elevator lifter is provided to engage the elevator to lift/elevate the microstructure away from the substrate generally after fabrication of the MEM system and prior to utilizing the microstructure in operation of the MEM system.

Growing community of inventors

Albuquerque, NM, United States of America

Murray Steven Rodgers