Stmicroelectronics Gmbh

Stmicroelectronics Asia Pacific Pte Limited

Murray J Robinson

Kenneth J Stewart

Frank R Bryant

Paul I Mikulan

Rube M Ross

TeckKhim Neo

A method of making inkjet print heads may include forming recesses in a first surface of a first wafer to define inkjet chambers. The method may also include forming openings extending from a second surface of the first wafer through to respective ones of the inkjet chambers to define inkjet orifices. The method may further include forming a second wafer including ink heaters, and joining the first and second wafers together so that the ink heaters are aligned within respective inkjet chambers to thereby define the inkjet print heads.

Method of making inkjet print heads having inkjet chambers and orifices formed in a wafer and related devices

In an embodiment, to deter or delay counterfeiting/cloning of a replacement component of a host device, the replacement component is provided with a code value. The code value is generated from a value of at least one physical parameter of the replacement component and is stored on the replacement component. The host device determines whether the replacement component is authentic if the stored code value matches a reference code value.

Delaying or deterring counterfeiting and/or cloning of a component

A microfabricated structure that includes a first layer of material on a substrate, and a second layer of material over the first layer that forms an encapsulated cavity, and a structural support layer added to the second layer. Openings can be formed in the cavity, and the cavities can be layered side by side, vertically stacked with interconnections via the openings, and a combination of both can be used to construct stacked arrays with interconnections throughout.

Micro-fluidic structure

A microfabricated structure and method of making that includes forming a first layer of material on a substrate, forming patterned sacrificial material having a predetermined shape on the first layer of material, and forming a second layer of material over the first layer and the patterned sacrificial material, which is then removed to form an encapsulated cavity. Ideally, the first and second layers are formed of the same type material. A structural support layer can be added to the second layer. Openings can be formed in the cavity, and the cavities can be layered side by side, vertically stacked with interconnections via the openings, and a combination of both can be used to construct stacked arrays with interconnections throughout.

Growing community of inventors

Corinth, TX, United States of America

Murray J Robinson