Intel Corporation

Murray Fitzpatrick Kelley

Mark T Bohr

Edward Allyn Burton

Shawn Michael Klauser

Techniques are described for fabricating integrated circuit devices that span multiple reticle fields. Integrated circuits formed within separate reticle fields are placed into electrical contact with each other by overlapping reticle fields to form an overlapping conductive interconnect. This overlapping conductive interconnect electrically connects an interconnect layer of a first reticle field with an interconnect layer of a second, laterally adjacent reticle field. The overlapping conductive interconnection extends into a common scribe zone between adjacent reticle fields.

Growing community of inventors

Albuquerque, NM, United States of America

Murray Fitzpatrick Kelley