Intel Corporation

University of Nevada

Muralidhar Tirumala

Mark A Trautman

Daryl James Nelson

Dhanesh Chandra

Anjali Talekar

Anupam Kumar

Gerald A Budelman

Peter O Butler

A method, apparatus, article of manufacture, and system, the method including, in some embodiments, processing a computational load by a first core of a multi-core processor, and dynamically distributing at least a portion of the computational load to a second core of the multi-core processor to reduce a power density of the multi-core processor for the processing of the computational load.

Method, system, and apparatus for dynamic thermal management

In some embodiments, cooling devices with metal hydrides are disclosed.

Method and apparatus for cooling devices using phase change materials

Method, system, and apparatus for dynamically distributing a computational load between clusters of cores at a frequency greater than a thermal time constant

A module which has an integral blower that cools an integrated circuit package. The blower is attached to a heat sink that is mounted to the integrated circuit package. Heat generated by the integrated circuit conducts to the heat sink. The blower generates a stream of air that flows across the heat sink and removes heat from the package. The module may have a manifold and duct that direct the airstream across the heat sink.

Integrated circuit package with an integral heat sink and fan

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Beaverton, OR, United States of America

Muralidhar Tirumala