Analog Devices,inc.

Hewlett-Packard Development Company, L.p.

Murali Chaparala

Michael J Daneman

Boris Kobrin

Behrang Behin

Chuang-Chia Lin

Chien-Hua Chen

Gary M Zalewski

James Richard Przybyla

James McKinnell

Arthur Piehl

Eric Lee Nikkel

Timothy E Beerling

Adel Jilani

Kenneth James Faase

Robert Newton Bicknell

Meng-Hsiung Kiang

Scott D Dalton

Franklin Joseph Wall

Bao Yeh

Stephen Panyko

Mark W Chang

James Mckinnell

Arthur R Piehl

Systems, methodologies, and other embodiments associated with a micro-electrical-mechanical system (MEMS) Fabry-Perot interferometric device (FPID) are described. Fabricating a MEMS FPID may include fabricating a pixel plate and a reflector plate so a Fabry-Perot cavity is defined therebetween. Fabrication may include producing a capacitor plate that facilitates electrostatically moving the pixel plate. Fabrication may include producing electrical connections between plates and producing circuitry to control plate voltages to facilitate creating an electrostatic force between plates. The MEMS FPID may include stops fabricated from a conductive material and circuitry for maintaining the stops and plates at an electrical potential that will yield a zero electric field contact event.

Fabry-perot interferometric MEMS electromagnetic wave modulator with zero-electric field

A polarizing photonic band gap system has a photonic crystal emitter. The photonic crystal emitter has a crystal end surface. The photonic crystal emitter is configured to generate electromagnetic energy having a wavelength &#x3bb;. The system has a polarizer. The polarizer is connected to the photonic crystal emitter. The polarizer has a polarizer surface. The polarizer surface is located within a distance of said crystal end surface. The distance is sufficient to quantum mechanically couple the polarizer surface with said crystal end surface at the wavelength &#x3bb;.

Polarizing photonic band gap system with reflector

An optical cross-connect switch comprises a base (), a flap () and one or more electrically conductive landing pads () connected to the flap (). The flap () has a bottom portion that is movably coupled to the base () such that the flap () is movable with respect to a plane of the base () from a first orientation to a second orientation. The one or more landing pads () are electrically isolated from the flap () and electrically coupled to be equipotential with a landing surface.

Optical cross-connect system

A property of a magnetic sensor, deployed on a micro machined optical element and exposed to a magnetic field, changes as the position of the micro machined optical element changes with respect to a magnetic field or, alternatively, when the magnetic field changes with respect to the micro machined optical element. The electrical, optical and/or mechanical change in sensor property varies according to the position, and a measurement of the property change tracks the change in orientation of a moveable portion of the optical element.

Magnetic position detection for micro machined optical element

An apparatus having magnetic detection sensor deployed on a micro machined optical element is exposed to a magnetic field to sense change in property as the micro machined optical element is manipulated with respect to the magnetic field, and, conversely when the magnetic field is manipulated with respect to the micro machined optical element. The electrical, optical and/or mechanical change in sensor property varies according to said manipulation, and telemetry created by said property change tracks the manipulation of the moveable portion of the optical element. The system includes a configuration capable of compensating for temperature variation.

Magnetic position detection apparatus for micro machined optical element

A microelectromechanical (MEMS) apparatus has a base and a flap with a portion coupled to the base so that the flap may move out of the plane of the base between first and second position. The base may have a cavity with largely vertical sidewalls that contact a portion of the flap when the flap is in the second position Electrodes may be placed on the vertical sidewalls and electrically isolated from the base to provide electrostatic clamping of the flap to the sidewall. The base may be made from a substrate portion of a silicon-on-insulator (SOI) wafer and the flap defined from a device layer of the SOI wafer. The flap may be connected to the base by one or more flexures such as torsional beams. An array of one or more of such structures may be used to form an optical switch.

MEMS mirrors with precision clamping mechanism

A method is disclosed for operating a MEMS device having a flap that is movable with respect to a base. The method includes applying a force to the flap to move the flap at least partially out of contact with an underlying base. Means for applying such a biasing force may be incorporated into a microelectromechanical (MEMS) apparatus having a base and a flap with a portion coupled to the base so that the flap may move out of the plane of the base between first and second position. The base may have a cavity with largely vertical sidewalls that contact a portion of the flap when the flap is in the second position Electrodes may be placed on the vertical sidewalls and electrically isolated from the base to provide electrostatic clamping of the flap to the sidewall. The base may be made from a substrate portion of a silicon-on-insulator (SOI) wafer and the flap defined from a device layer of the SOI wafer. The flap may be connected to the base by one or more flexures such as torsional beams. An array of one or more of such structures may be used to form an optical switch.

Use of applied force to improve MEMS switch performance

Growing community of inventors

Vancouver, WA, United States of America

Murali Chaparala