Korea Institute of Science and Technology

Munju Goh

Nam Ho You

Bon-Cheol Ku

Hyeonuk Yeo

Seokhoon Ahn

Se Gyu Jang

Ok-kyung Park

Joong Hee Lee

Sang Jun Youn

Young Soo Kim

Myung Jong Kim

Jin Young Jung

Jun Kyung Kim

Yong Mun Choi

Hong Jin Lim

Jin Won Yu

Young Bum Hong

Han Sol You

Chiyoung Park

The present disclosure relates to a high thermal conductive polymer composite, comprising: a liquid crystalline resin comprising a mesogen and at least one linear polymerization reactive group, wherein the liquid crystalline resin is cured with a linear polymerization initiator and includes a molecular structure aligned in at least one direction.

Composites with enhanced thermal conductivity and method preparing the same

Disclosed is a liquid crystalline epoxy compound wherein an epoxy group is positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage. Since the liquid crystalline epoxy compound includes an epoxy group positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage, the interaction between the mesogens in a cured resin product occurs significantly without weakening even after curing, thereby improving the heat conductivity of the resin compound through the active heat transfer between the mesogens.

Liquid crystalline epoxy compound with terminal mesogen connected by flexible linkage and method for preparing the same

A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOY(wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1&#x2264;m&#x2264;8 and n is a number satisfying 1&#x2264;n&#x2264;6), and a reaction solvent, wherein X is capable of being dissociated from XOYand Y radical is capable of being produced from XOYin the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200&#xb0; C., specifically 100&#xb0; C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.

Method and composition for depolymerization of cured epoxy resin materials

For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200&#xb0; C., specifically 100&#xb0; C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.

Composition and method for depolymerization of cured epoxy resin materials using transition metal salts

Provided are a transparent heat-insulating material including a transparent heat-insulating resin layer including polymer capsules and an optical resin, and a method for preparing the same. The transparent heat-insulating material may reduce the transmission of radiative heat of solar radiation energy entering from the exterior, and prevent discharge or loss of heat when indoor heating, while showing high transparency as well. In addition, the transparent heat-insulating material may allow easy control of the size of capsules contained in a transparent heat-insulating film, and may be obtained through a simple and easy process. Further, it is possible to control the light transmittability and heat-insulating property of the transparent heat-insulating material with ease.

Transparent and heat-insulating material including polymer capsule and method for preparing the same

Provided are a method for post-treatment of a carbonaceous material using dehydrocyclization, a carbonaceous material post-treated by the method, and a polymer composite material including the carbonaceous material. More particularly, provided are a method for post-treatment of a carbonaceous material using dehydrocyclization, including subjecting the carbonaceous material to dehydrocyclization at room temperature to heal structural defects in the carbonaceous material, while increasing the effective conjugated length of the carbonaceous material to improve the electrical conductivity thereof, as well as a carbonaceous material post-treated by the method and a polymer composite material including the carbonaceous material.

Post-treatment method of carbon materials for improving the electrical conductivity and mechanical properties via dehydrocyclization reaction and polymer composite materials comprising the treated carbon materials

The present disclosure relates to a polyimide-graphene composite material and a method for preparing same. More particularly, it relates to a polyimide-graphene composite material prepared by adding modified graphene and a basic catalyst during polymerization of a polyimide precursor so as to improve mechanical strength and electrical conductivity and enable imidization at low temperature and a method for preparing same.

Growing community of inventors

Jeollabuk-do, South Korea

Munju Goh