Mitsubishi Electric Corporation

Muneyuki Ooshima

Mitsunori Nishida

Eitaro Fukuzumi

A surface-mount component (A) having a pair of connection terminals () with an inter-terminal pitch Ltherebetween is mounted on a circuit substrate (A) having a pair of electrode pads () with an inter-electrode pitch Ltherebetween (L&#x3e;L). Standard position indication marks () are formed on the circuit substrate (A). When heating is performed under a state in which solder non-wetting of the left electrode pad () occurs, the solder applied to the right electrode pad () solder connects the right electrode pad () and the connection terminal (), and the surface-mount component (A) is attracted to the left and is offset or displaced from the standard position indication marks () by an offset dimension &#x3b4;. If the solder is applied to the left and right electrode pads (), there is no offset dimension.

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Tokyo, Japan

Muneyuki Ooshima