Sony Corporation

Muneyuki Haruki

Kenji Ohsawa

Nobuyuki Yasuda

Takao Ito

Yuji Ikegami

Akira Tsutsumi

Masayuki Ohta

Hiroshi Kumakura

Junji Suzuki

A circuit board comprises a rigid metal substrate, a conductive metal layer formed into a predetermined circuit pattern, and a resinous layer interposed between the metal substrate and the metal layer for electrically insulating and bonding the metal substrate and the metal layer, the conductive metal layer having an elongation at break of not less than 15%, and the resinous layer comprising a first resinous layer having a volume resistivity of not less than 10.sup.10 .OMEGA.. cm, and a second resinous layer having an elongation at break of not less than 100%. The circuit board has a desired dielectric strength between the metal substrate and the conductive metal layer and can be bent without resulting disconnection in the metal layer or the like.

Circuit board

Growing community of inventors

Kanagawa, Japan

Muneyuki Haruki