Murata Manufacturing Co., Ltd.

Muneyuki Daidai

Akihiro Nomura

Koji Morita

Masanobu Sugimori

Masahiro Saito

Tetsuo Takeshima

Manabu Sumita

Takeshi Kishimoto

Hiroki Kitayama

Yasuharu Matsui

Masayuki Fujino

Takamasa Kuboki

Toshiaki Sugimura

Koji Nagahara

Atsushi Sugimasa

Junji Oyama

Haruhide Otomura

Shigehisa Yago

A quartz crystal resonator unit that includes: a quartz crystal resonator including an excitation electrode and a connection electrode electrically connected to the excitation electrode; a base member including an electrode pad; an electrically conductive holding member that connects the connection electrode and the electrode pad to each other; and a lid member attached to the base member so as to form an internal space between the lid member and the base member in which the quartz crystal resonator is accommodated. The electrically conductive holding member is a cured product of an electrically conductive adhesive containing (1) a silicone resin as a main component and (2) an epoxy compound having two or more epoxy groups.

Quartz crystal resonator unit, electronic component, and electronic device

A piezoelectric vibration component that includes a piezoelectric vibrator, a substrate, and a conductive adhesive that bonds the piezoelectric vibrator to the substrate. The conductive adhesive contains a silicone-based base resin, a cross-linker, a conductive filler, and an insulating filler. The silicone-based base resin has a weight-average molecular weight of 20,000 to 102,000. The cross-linker has a number-average molecular weight of 1,950 to 4,620. The conductive filler and the insulating filler have a particle size of 10 &#x3bc;m or less.

Piezoelectric vibration component and application method

An electronic component that includes an electronic component body, sealing members sealing the electronic component body, and adhesive layers which adhere the electronic component body and the sealing members, respectively. Between the electronic component body and the sealing members, sealed spaces are formed, respectively. The adhesive layers each contain organic fillers and inorganic fillers. The organic fillers are in contact with both the electronic component body and the sealing members. The inorganic fillers each have a minimum particle diameter smaller than the thickness of each of the adhesive layers. When the adhesive layers are viewed in a thickness direction thereof, the inorganic fillers are provided between the organic fillers and the electronic component body and between the organic fillers and each of the sealing members.

Electronic component and method for manufacturing the same

A method of manufacturing a piezoelectric component includes forming an unhardened first elastic material partially on at least a pair of end portions of a piezoelectric element, the pair of end portions including an edge portion of the piezoelectric element, hardening the first elastic material, forming an unhardened second elastic material on the entire circumference of the piezoelectric element and the first elastic material, hardening the second elastic material, forming an unhardened outer-cladding resin on the entire circumference of the second elastic material covering the piezoelectric element and the first elastic material, and hardening the outer-cladding resin.

Method of manufacturing piezoelectric component

An electronic chip component includes a package provided with external electrodes having excellent heat resistance and adhesion. In the electronic chip component, a package includes heat-resistant resin molding, and the external electrodes are provided on the surface of the package. The resin molding include a polymeric material having polar groups of at least one of an ether group, an ester group, a hydroxyl group, a carbonyl group, an amido group, and an imido group. The external electrodes have a multilayer structure having at least two layers including a lowermost layer containing a conductive film formed by baking conductive paste composed of a resin composition and metal particles at a low temperature, the resin composition including a compound having a trifunctional or higher functional group in one molecule. Each of the external electrodes includes an uppermost layer including a metal plate having good solderability.

Electronic chip component

A chip-type piezoelectric component has greatly increased bond strength of external electrodes while allowing the external electrodes to be easily formed. The external electrodes including a conductive paste are continuously formed on the side surface of a laminated body in which a piezoelectric element is laminated with seal substrates in addition to embedding a part of the external electrodes in recesses in which terminal electrodes of the piezoelectric element have been exposed. A metal plating layer having good solder wettability is provided on the outermost layer of the external electrode. The bonding strength between the external electrode and the laminated body is greatly improved by the wedge effect of the conductive paste penetrated in the recess, thereby preventing the electrode from peeling. The electrical continuity between the terminal electrode and the external electrode of the piezoelectric element is greatly improved because a portion of the external electrode is embedded in the recess in which the terminal electrode of the piezoelectric element is exposed.

Chip-type piezoelectric component

A piezoelectric acoustic component includes a diaphragm having a substantially rectangular piezoelectric plate including front and back surfaces, an electrode disposed on the front surface, a substantially rectangular metal plate bonded to the back surface of the substantially rectangular piezoelectric plate directly or via an electrode disposed on the back surface of the substantially rectangular piezoelectric plate, an insulating cap having an upper wall, four side walls extending from the upper, a pair of support members arranged to support the diaphragm at the inside of the two of four sides walls opposed to each other, and a plate shaped substrate having a first electrode section and a second electrode section. The diaphragm is disposed the insulating cap. Two of four side edges of the diaphragm are opposed to each other and fixed to the pair of support members. A gap is formed between the other two of four side edges of the diaphragm and the cap and is sealed by elastic sealing material. An acoustic space is provided between the diaphragm and the upper wall of the insulating cap. An opening edge of the four side walls of the insulating cap is bonded to the substrate. The metal plate is electrically connected to the first electrode section. The electrode disposed on the front surface of the substantially rectangular piezoelectric plate is electrically connected to the second electrode section.

Piezoelectric acoustic component

A piezoelectric component includes a substantially rectangular shaped piezoelectric element, a first elastic material covering at least a pair of end portions of the piezoelectric element, the pair of end portions including edge parts of the piezoelectric element, a second elastic material covering the entire piezoelectric element and the first elastic material, and an outer-cladding resin covering the whole circumference of the piezoelectric element which is covered with the second elastic material.

Piezoelectric component and method of manufacturing same

A surface mounting type piezoelectric component includes an insulating substrate, an external electrode disposed on the insulating substrate, and a piezoelectric element including an electrode. The piezoelectric element is fixed to the insulating substrate and the electrode of the piezoelectric element is connected to the external electrode. A metal cap is fixed to the insulating substrate via an adhesive agent and covers the piezoelectric element. A glass transition temperature of the adhesive agent in a cured state is about 120 degrees centigrade or more. A difference between absolute values of a thermal-expansion-coefficient of the metal cap and of the insulating substrate is about 8 ppm/degrees centigrade or less.

Surface mounting type piezoelectric element

An organic silicon compound 10 is applied around vibrating electrodes 3a and 3b of a piezoelectric resonant element 1. A compound such as silane, chlorosilane, silazane, silthiane, siloxane, cyclosilane, cyclosilazane, cyclosilthiane, cyclosiloxane, silanol, or metallosilicone is used as the organic silicon compound 10. Around the piezoelectric resonant element 1 and the organic silicon compound 10, for example, an ultraviolet ray curing resin is applied, and the ultraviolet ray curing resin is cured, thereby a permeable film 11 is formed. A cavity 12 is formed around the vibrating electrodes 3a and 3b by dispersing the organic silicon compound 10 to the outside through the film 11. Around the film 11, for example, an outer coating resin is applied, and the outer coating resin is cured, thereby an outer coating material 13 is formed.

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Toyama, Japan

Muneyuki Daidai