Matsushita Electric Industrial Co., Ltd.

Muneyoshi Fujiwara

Wataru Hirai

Kurayasu Hamasaki

Kunio Sakurai

Hirokazu Honkawa

Seiichi Mogi

Hiroshi Ohta

Osamu Okuda

Takahiro Yonezawa

Ken Takano

Yoshiyuki Nagai

Akiko Ida

Satoshi Shida

Yoshihiko Misawa

Toshiaki Yamauchi

Minoru Yamamoto

Hiroaki Onishi

Makito Seno

Ryoji Inutsuka

Naoyuki Kitamura

Toshinori Mimura

Hiroshi Yamauchi

Kunio Ohe

Hideo Sakon

Susumu Takaichi

Koichi Morita

Jun Shirai

Naohiko Chimura

Apparatus for mounting components, even if the components have narrow inter-component distances, without producing any interference between already mounted components and suction nozzles or components being suction-held by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting electronic components on a printed circuit board, includes a control section containing information relating to components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that components to be mounted are mounted in ascending order of height.

Apparatus for mounting component

By using an application unit having: a storage chamber for a viscous material; a discharge hole, for the viscous material, provided so as to communicate with the storage chamber, where a viscous-material feeding device for feeding the viscous material to the storage chamber is coupled to the application unit; and a discharge-pressure adjusting device for imparting a discharge pressure to the viscous material stored in the storage chamber, a screen mask having openings corresponding to the application object or the application object itself and the discharge hole of the application unit are brought into contact with each other, either the application unit and the screen mask or the application unit and the application object are moved relative to each other while the discharge pressure is imparted to the viscous material in the storage chamber, and the viscous material is applied onto the application object while the storage chamber is replenished at all times with the viscous material by the viscous-material feeding device with a pressure smaller than the discharge pressure imparted by the discharge-pressure adjusting device.

Method and apparatus for applying viscous material

Apparatus for mounting components, even if the components have narrow inter-component distances, without producing any interference between already mounted components and suction nozzles or components being suction-hold by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting electronic components on a printed circuit board, includes a control section containing information relating to components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that components to be mounted are mounted in ascending order of height.

Apparatus for mounting components

Each of a plurality of suction nozzle sections provided about the outer circumference of an intermittently rotating head section comprises a plurality of nozzle tip sections for picking up electronic components by suction, these nozzle tip sections being connected to a rod section , which is driven to rotate by a motor . A cylindrical cam section having a cam surface and being able to rotate relative to the rod section is provided such as to encase the nozzle tip sections , and one ends of the nozzle tip sections engage with the cam surface 8a of the cam section via rollers , whereby the nozzle tip sections are movable in a vertical direction. On the outer side of the cylindrical cam section , a stopper section is provided for halting temporarily the rotation of only the cylindrical cam surface

Electronic component mounting apparatus

It is an object of the invention to suck the central position of an electronic part precisely, and enhance the successful suction rate of electronic parts. To achieve the object, the central position of the suction opening provided in the nozzle tip end for sucking an electronic part is deviated from the central position of rotation of the nozzle tip end by a specified amount, and the rotation amount of the nozzle tip end and the positioning position of the part supply portion are controlled.

Electronic part mounting machine

By lightening the impact load to an electronic component and greatly promoting the load range, the adaptability to the electronic components is enhanced and the manned manual operation is eliminated, thereby improving the productivity and realizing unmanned operation. The vacuum-clamping nozzle unit comprises an automatically detachable vacuum-clamping nozzle (,) for vacuum-clamping the electronic component, a positioning section (,) for positioning the vacuum-clamping nozzle (,) in a rotating direction and a vertical direction, a pushing section (,) for urging said vacuum-clamping nozzle (,) downward by using fluid, a fluid pressure switching section for switching the urging force, a timing switching section for switching the timing of the urging force of said vacuum-clamping nozzle, and a pressure control section for controlling the load to a desired load. Switching the timing of the urging force can be made before or at the time of mounting the electronic component on an electronic circuit board.

A method for supporting a printed board. Includes a first step of conveying to a specified position by a conveying a printed board having a first reference hole and a second reference hole device a for setting a position and posture thereof. A second step stops the conveyed printed board at the specified position with a stop member. A third step inserts a first reference pin provided at the specified position into the first reference hole of the stopped printed board. A fourth step inserts a second reference pin into the second reference hole of the printed board. The second reference pin is movable in parallel to a mounting surface of the printed board and in any arbitrary direction relative to the first reference pin. A fifth step pinches the printed board to hold the position and posture thereof of a holding device with the first reference pin and the second reference pin both inserted. A sixth step draws out, after the fifth step, at least one reference pin of the first reference pin and the second reference pin from its corresponding reference hole. A seventh step mounts after the sixth step, an electronic component onto the printed board under the control of a control unit.

Method and apparatus for supporting printed board

A component-mounting apparatus includes a component supply mechanism for supplying components to be mounted on a circuit board, a circuit board positioning device for placing in position the circuit board on which the components are to be mounted, and a mounting head for taking out one of the components at a predetermined component take-out position of the component supply mechanism, thus mounting the component on the circuit board. The component supply mechanism includes a plurality of supply tables on which a plurality of component supply devices have been arranged at predetermined intervals, a driving device for moving the supply tables in a direction in which the component supply devices have been arranged, thus placing the desired component supply device at the predetermined component take-out position, and a table exchange device provided at one end of a movable range of the supply tables to be driven by the driving device and allow the supply tables to be placed thereon and allow positions of the desired supply table to be switched by the driving device.

Component-mounting apparatus and method

A method for mounting components, includes a first step for feeding to a component feed unit a plurality of stacked-in-stages trays on which components are accommodated, a second step for taking out the components of a Top-stage tray sequentially one by one to mount them onto a board, and a third step for, when the components on the tray are exhausted, removing the empty top-stage tray, and then returning to the second step. An apparatus for mounting Components includes a component feed unit for feeding a plurality of stacked-in-stages trays on which components are accommodated, and a pickup device which can selectively hold either a component pickup nozzle or a tray transfer nozzle. The pickup device is movable between the component feed unit and a specified position of a substrate or between the component feed unit and a tray removal box. A nozzle replacement unit is provided for performing replacement of the pickup nozzle and the tray Transfer nozzle. Also, a control unit is provided for deciding whether or not a component is present on the tray, and controlling the pickup head and the nozzle replacement units in such a manner that, if a component is present, picking up the component by the pickup nozzle and placing it onto the substrate, and if no component is present, replacing the pickup nozzle with the tray transfer nozzle, and picking up the tray and removing it to the tray removal box.

Method and apparatus for mounting component

A mounting apparatus for mounting electronic components, includes a component feeding section wherein plural component feeding units accommodating plural components and sequentially supplying components to a predetermined component take-out position are arranged on a moving table along a moving direction, a positioning mechanism of a mounting member to which one component is to be mounted, and a mounting device for holding one component at a predetermined position in the feeding section and mounting the component onto the mounting member. The mounting device includes a movable member which is vertically movable and has a gas groove which is formed at an inside part of the movable member, and a rotary member which is rotatable around a vertical axis of the movable member and has at its inside part a gas groove which is formed at an inside part of the rotary member and is communicated with the groove of the movable member so as to transmit gas between the grooves during operation. The mounting device also includes a pressure gas transmitting member having positive and negative pressure holes of gas passages formed at its inside, and a gas switching member having a gas groove communicating with a suction passage of a suction member for sucking the component. The switching member is movable to selectively switch between states where the suction passage is communicated with the positive pressure hole and the negative pressure hole, respectively.

Mounting apparatus of electronic component

A component placement machine for mounting, on a substrate placed in position by an XY-table, a first electronic component supplied from an electronic component-supply section, includes an electronic component-holding portion for holding the first electronic component and being vertically movable; and a device for setting a movement-prohibiting time period of the XY-table by calculating a period of time in which there is a possibility that the first electronic component and a second electronic component mounted on the substrate may interfere with each other, based on a height of the first electronic component and a maximum height of the second electronic component.

Apparatus for mounting electronic component on substrate

In an electronic chip placement machine with test function, there is provided a suction nozzle for holding a chip, a chip-regulation device for regulating the attitude of the chip by clamping the chip at portions having no electrodes probes for testing electrical characteristics of the chip. The tip portion of the suction nozzle is made of an insulating material such as a ceramic or a synthetic resin in order to avoid a short-circuit between electrodes of the chip through the nozzle. Therefore, the electrical characteristics of the chip can be tested without the separation between the nozzle and the chip. Furthermore, since one cycle of the operational process according to the present invention is shorter than that of the conventional operational process, it is possible to provide chip-test and placement machines whose structure is simple. As a result, productivity and durability can also be increased.

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Katano, Japan

Muneyoshi Fujiwara