Hitachi, Ltd.

Tanaka Matthey Co., Ltd.

Munetoshi Zen

Kazutaka Sato

Michihiro Watanabe

Kazuhiko Ato

Hideo Miura

Hiroyuki Ohta

Mitsuo Usami

Masatsugu Kametani

Noriaki Okamoto

Shigeru Obata

Yoshinobu Watanabe

Sadayoshi Taguchi

Taisaku Seino

Kentaro Hamma

Katsuhiko Kamachi

Kazuhiko Atoh

Maya Arai

Kazuhiko Atou

A process of contacting sides of a plurality of chips having semiconductor elements formed in a substrate surface, directly to each other on the same &lcub;111&rcub; crystal plane.

Semiconductor device and method for fabricating the same

Prevention of reduction in the production yield due to the increase in the area of a semiconductor chip permits a sophisticated-performance single-chip semiconductor device to be fabricated. This also permits a many-kind small-amount production of semiconductor devices to be implemented. After plural semiconductor chips 2 and 3 are fabricated separately, only defect-free chips of them are selected. The selected defect-free chips are connected in contact between their side walls of their densest faces of atoms of their substrates so that the surfaces 4a and 4b where elements are to be formed are located in the same plane. Thus, even when the chip area is increased, reduction of the production yield can be prevented, thereby permitting a large-area sophisticated-performance single chip semiconductor device to be fabricated. If many kinds of semiconductor chips are prepared and connected in their combination in a variety of forms, it is possible to realize a many-kind small-amount production of semiconductor devices.

Semiconductor device having plural chips with the sides of the chips in

A thick film type thermal head produced by consecutively forming, on an insulator substrate, a heat-resistant layer, an electrode, a heating resistor and a protective layer, wherein the protective layer comprises an electrically insulating protective layer covering the heating resistor and that portion of the electrically insulating protective layer which corresponds to a medium comprises a heat-diffusing coating having a high thermal conductivity over the electrically insulating protective layer.

Thick film type thermal head and thermal recording device

A thermal head obtained by calcining a mixed material comprising at least ruthenium oxide particles having specific surface area of 10 to 45 m.sup.2 /g and a particle size of 1 .mu.m as the upper limit value of particle size distribution, glass fine particles and a dispersant which disperses these fine particles and disappears by calcining can reduce scattering of resistance values and give high image quality at thermal printing.

Thick film resistor material and thermal head obtained therefrom

A thermal head obtained by calcining a mixed material comprising at least ruthenium oxide particles having a specific surface area of 10 to 40 m.sup.2 /g and a particle size of 1 .mu.m as the upper limit value of particle size distribution, glass fine particles and a dispersant which disperses these fine particles and disappears by calcining can reduce scattering of resistance values and give high image quality at thermal printing.

A thick film type thermal printing head is characterized by having as a protective film a surface layer of at least one amorphous glass layer and an underlying layer of at least one crystallized glass layer or inorganic material-filled amorphous glass layer to increase reliability and life of the printing head.

Thick film type thermal head

The first and second electrodes, to which a recording signal is to be applied, are printed to a desired pattern on an insulating substrate by, for example, a screen printing method. A heating resistor is formed by, for example, a screen printing method so as to be bridged over these first and second electrodes. A protective layer is formed so as to cover the first and second electrodes and heating resistor therewith. Each of the heating portions of the heating resistor is provided with one or a plurality of laser-made holes, and the resistance value of each heating portion of the heating resistor is regulated to a predetermined level on the basis of the number of the laser-made holes.

Growing community of inventors

Kashiwa, Japan

Munetoshi Zen