Matsushita Electric Industrial Co., Ltd.

Munekazu Nishihara

Kenichiro Suetsugu

Tetsuo Fukushima

Junji Ikeda

Takaaki Higashida

Daisuke Suetsugu

Kenichi Yamamoto

Youichi Ohnishi

Kenichi Sato

Takafumi Okuma

Masahide Yokoyama

Isamu Aokura

Takashi Imanaka

Hirotaka Hisamura

Hatsuhiko Shibasaki

Teiichi Kimura

Mikio Takebayashi

Jun Katsube

Hisayoshi Watanabe

Shinsuke Itoi

Toru Uchida

Jyunji Ikeda

Yakeshi Yoshii

Kazumi Nishimura

Seiji Nakashima

Masato Tanida

Osamu Sengoku

A circuit substrate has a flexible thin film, electric wires supported on the film, and an electronic component supported on the film and positioned between the wires so that the wires and the component are electrically connected serially. Also, a thickness of the component is less than that of the electric wires.

Circuit substrate and its manufacturing method

A capacitor ( ) using a flexible substrate ( ) includes a hole portion ( ) formed in a dielectric ( ) to connect an upper electrode ( ) to an external leader electrode ( ). At least part of the hole portion ( ) extends from its lower end to upper end at an inclination between 0.1 and 20&deg; with respect to a top surface of the external leader electrode ( ). Then, an upper end corner of an inclined wall surface of the upper electrode ( ), which inclines along the hole portion ( ) of the dielectric ( ), has a downward inclination between 0.1 and 20&deg;. A lower end corner of the inclined wall surface of the upper electrode ( ), which inclines along the hole portion of the dielectric ( ), has an upward inclination between 0.1 and 20&deg;. As a result, stress concentration on the corners of the upper electrode ( ) is drastically reduced to prevent the upper electrode ( ) from cracking.

Capacitor and manufacturing method thereof

In a sputtering apparatus, in a vacuum chamber having a gas supply and a gas discharge functions, a substrate is set to a supporting part therefor and a target is disposed at an electrode connected with a power source within a plane opposite to the substrate, so as to form a film while holding the substrate in a fixed state to the target. The electrode is divided into three or more electrode parts, the target is divided and disposed on the three or more electrode parts within the plane, and a magnet is arranged for each divided target at a position where a line of magnetic force on a surface of the each target is generated by each magnet.

Sputtering apparatus

An ionization deposition apparatus includes an ion source which is located in a vacuum chamber and which is provided with gas introduction ports for supplying a gaseous film material into the vacuum chamber, a filament unit, which is separated into a plurality of independently controllable filaments, for generating thermoelectrons when the filaments are heated by filament currents, and an anode electrode for accelerating and colliding the thermoelectrons against molecules of the gaseous film material to thereby turn the molecules to plasma. A holder for holding a to-be-deposited object, the holder being placed confronting the anode electrode of the ion source in the vacuum chamber, and connected to a bias source to attract ions in the plasma to a surface of the holder.

Ionization deposition apparatus

An optical waveguide includes a substrate in the form of either a silicon substrate with a silicon oxide layer formed at its upper surface or a quartz substrate, a first waveguide layer extending over the entire upper surface of the substrate, a layer having a low refractive index and a tapered end disposed over part of an upper surface of the first waveguide layer, and a second waveguide layer of the same refractive index as that of the first waveguide layer extending over an exposed surface of the first waveguide layer and an upper surface of the layer of low refractive index.

Optical waveguide manufacturing method

A method for molding an article integrated with a multi-layer flexible circuit by embedding the circuit in a molding material to be shaped into a certain configuration. A first flexible circuit layer is sandwiched between a fixed mold and a movable mold so as to perform an injection shaping of one side of the molding material. A plurality of flexible circuits from the second layer of flexible circuit and subsequent flexible circuits are sequentially sandwiched between the fixed mold and the movable mold and they are layered one on the other. The movable mold contains a heater. The pattern of each flexible circuit is traced with thermosetting conductive paste which is hardened by the heater of the movable mold when flexible circuits are laminated on each other. Each flexible circuit has a hot-melt type adhesive layer on the rear surface thereof. The adhesive layer is melted by the heater of the movable mold so as to place each flexible circuit layer in position when flexible circuits are laminated on each other. Through-holes are formed by punching and conductive paste is charged into the through-holes with the last layer of flexible circuit sandwiched between the fixed mold and the movable mold. Then, the injection shaping of the other side of the material is carried out.

Method for molding an article integrated with a multi-layer flexible

An optical waveguide device includes a plurality of optical waveguides extending adjacent each other in a sheet-like form. Each of the waveguides includes core portion, an inner cladding layer formed on a periphery of the core portion, and an outer cladding layer formed on a periphery of the inner cladding layer. The inner cladding layer is devoid of light scatterers, whereas the outer cladding layer has light scatterers disposed therein. As light travels within the core portion, such light is efficiently reflected at the surface of the inner cladding layer. The outer cladding layer having the light scatterers disposed therein functions to inhibit crosstalk between adjacent waveguides.

Optical wave guide sheet comprising plurality of doubly-clad core

An optical waveguide and an image sensor using the same, the optical waveguide comprising a plurality of bar-shaped cores that are aligned in a proper manner, the cores being made of transparent materials with a large refractive index, and a cladding that is disposed around the cores, the cladding being made of materials with a small refractive index that are capable of absorbing or scattering light, wherein part of each of said cores on which irradiated light is incident is uncovered, or part of said cladding on which irradiated light is incident is transparent.

Optical waveguide and an image sensor using the same

A bicycle frame comprising a lug and a pipe to be fitted onto a projection at the lug, annular grooves opposite to each other being disposed at the mutual contact surfaces of the lug projection and pipe, wherein an unidirectional form memory alloy changeable of its outer diameter by heating is disposed in one of the opposite annular grooves, and the projection of the lug and the pipe are bonded at the fitting surfaces by means of a thermosetting adhesive, whereby the bicycle frame is high in safety and superior in productivity and has an improved bonding strength and mechanical juncture.

Bicycle frame

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Neyagawa, Japan

Munekazu Nishihara