Intel Corporation

Munehiro Toyama

Charan K Gurumurthy

Kian Sin Sim

Siew Fong Tai

Tamil Selvy Selvamuniandy

Bijay S Saha

Selvy Tamil Selvamuniandy

Shripad Gokhale

Charavanakumara Gurumurthy

Toshimi Kohmura

Kathy Wei Yan

Samir Pandey

Ngoc K Dang

Omar James Bchir

Charavana K Gurumurthy

Ehab A Nasir

A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

Grid array connection device and method

Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a die attach area, and forming a layer on the substrate outside of the die attach area. The layer may be formed from a fluoropolymer material. The method also includes coupling a die to the substrate in the die attach area, wherein a gap remains between the die and the die attach area. The method also includes placing an underfill material in the gap and adjacent to the layer on the substrate. Examples of fluoropolymer materials which may be used include polytetrafluoroethylene (PTFE) and perfluoroalkoxy polymer resin (PFA). Other embodiments are described and claimed.

Reducing underfill keep out zone on substrate used in electronic device processing

An embodiment of the present invention is a technique to reduce interconnect length between devices. A cavity is formed in a substrate having a substrate surface. The cavity has a depth. A first device having a device surface and a thickness is placed into the cavity. The thickness matches the depth such that the device surface is approximately planar with the substrate surface. The first device is attached to a second device via bumps on the second device.

Embedding device in substrate cavity

A method includes forming a coating on a land contact of a package substrate, the coating including a first material disposed between a first layer and a second layer, each of the first layer and the second layer being made of a second material including gold. An apparatus includes a package substrate including a plurality of land contacts wherein each of the plurality of land contacts includes a coating including a first material disposed between a first layer and a second layer, each of the first layer and the second layer being made of a second material including gold.

Method of substrate manufacture that decreases the package resistance

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Tsukuba, Japan

Munehiro Toyama