Nec Corporation

Renesas Electronics Corporation

Nanobridge Semiconductor, Inc.

Leland Stanford Junior University

Nec Electronics Corporation

Nec C Orporation

Munehiro Tada

Yoshihiro Hayashi

Toshitsugu Sakamoto

Hiromitsu Hada

Naoki Banno

Makoto Miyamura

Naoya Furutake

Hiroto Ohtake

Mari Amano

Koichiro Okamoto

Fuminori Ito

Hironori Yamamoto

Yukihide Tsuji

Tsuneo Takeuchi

Masayoshi Tagami

Yoshimichi Harada

Tatsuya Usami

Ryusuke Nebashi

Xu Bai

Yukishige Saito

Yuko Yabe

Shinobu Saitoh

Tadahiko Sugibayashi

Noboru Sakimura

Krishna Chandra Saraswat

Ayuka Tada

Masayuki Terai

Makoto Ueki

Takahiro Onodera

Noriyuki Iguchi

Hideaki Numata

Yukihiro Sakotsubo

Hiroto Ootake

Ken′ichiro Hijioka

A switching element that has reduced switching voltage and leakage current and that demonstrates high reliability and low power consumption is achieved as a result of comprising: a first insulation layer in which first wiring mainly consisting of copper is embedded in a first wiring groove that opens upward; a second insulation layer which is formed on an upper surface of the first insulation layer and the first wiring and has an opening that reaches the first insulation layer and the first wiring; a first electrode which is the portion of the first wiring that is exposed from the opening; an oxygen supply layer which is formed on an upper surface of the second insulation layer, generates oxygen plasma during etching to form the opening in the second insulation layer, and remains at least in the vicinity of the opening of the upper surface of the second insulation layer; an ion conducting layer which is formed on the upper surface of the first insulation layer and the first electrode that are exposed from the opening, an inner surface of the opening of the second insulation layer, and an upper surface of the oxygen supply layer; and a second electrode that is formed on an upper surface of the ion conducting layer.

Switching element and method for manufacturing same

This switch element includes a resistance change element, a first transistor, and a second transistor. The resistance change element includes: a metal deposition type resistance change film; a first electrode; and a second electrode. To the second electrode, a source or a drain of the second transistor is connected. The switch element has a first mode and a second mode, when a potential of the second electrode is made higher than that of the first electrode and the resistance change element is switched from the low resistance state to the high resistance state. The gate voltage is greater in the first mode than in the second mode, and a potential difference between the first and second electrodes is smaller in the first mode than in the second mode.

Switch element, switching method and semiconductor device

Provided is a resistance variation element including a resistance variation film of a metal depositing type, a first electrode which contacts with a first surface of the resistance variation film in a predetermined first region and supplies metallic ions via the first region, and a second electrode laminated on a second surface of the resistance variation film. The first region includes a recessed region surrounded by a simple closed curve or a region surrounded by a plurality of simple closed curves. A line segment which passes through a point outside of the first region, ends of which exist on the simple closed curve, and each point of which in the vicinity of both the ends other than both the ends is outside of the first region, exists, and an edge of the first electrode is formed in a part of the simple closed curve including both the ends.

Resistance variation element, semiconductor device, and manufacturing method

Provided is a rectifying element that prevents erroneous writing and an erroneous operation and that is substituted for a select transistor; a rewritable semiconductor device that uses a nonvolatile switch including the rectifying element and having excellent reliability, a small area, and low power consumption has a stacked structure of a first electrode, a first buffer layer, a rectifying layer, a second buffer layer, and a second electrode; and the rectifying layercomprises a first silicon nitride layerhaving a high nitrogen content (50 atm % or more) and second silicon nitride layersA andB having a lower nitrogen content than the first silicon nitride layer(50 atm % or less), wherein the second silicon nitride layersA andB are in contact with the first and second buffer layers (), respectively, and the first silicon nitride layeris sandwiched between the second silicon nitride layersA andB.

Rectifying element and switching element having the rectifying element

Provided are: a semiconductor device in which a non-volatile switch provided with a rectifying element and a non-volatile element provided with no rectifying element are formed in the same wiring; and a method for producing the semiconductor device. The semiconductor device includes a first switching element and a second switching element disposed in a signal path of a logic circuit. The first switching element includes a rectifying element and a variable resistance element. The second switching element does not include the rectifying element but includes a variable resistance element. The first switching element and the second switching element are formed in the same wiring layer.

Semiconductor device and method for producing semiconductor device

A switch circuit includes: a plurality of four-terminal switches having variable-resistance elements and a rectifier element serially connected; an input line and an output line, at least one of which is multiply present, to which are connected terminals of two switches other than terminals at which the variable-resistance terminals are serially connected; and a control line to which are connected the terminals of the two switches other than the terminals at which the rectifier elements are serially connected, the control line, together with the input line and the output line, turning on and off in turn, by pair, the pair of variable-resistance elements connected to the input line and the pair of variable-resistance elements connected to the output line, among the variable-resistance elements of the plurality of four-terminal switches of the four-terminal switches connected to the input line or the output line.

Switch circuit, semiconductor device using same, and switching method

To stabilize programming operation and to reduce leakage current. A variable resistance element according to the present invention is provided with: an interlayer insulating film; a first electrode that is formed within the interlayer insulating film and comprises an active electrode, the side surface and the bottom surface of which are covered by a barrier metal; a variable resistance film that is formed on the upper surface of the first electrode; a second electrode that is formed on the variable resistance film; and an insulating film spacer that is formed between the variable resistance film and the barrier metal which covers the side surface of the first electrode. In this connection, the variable resistance film and the barrier metal which covers the side surface of the first electrode are in contact with the insulating film spacer, respectively.

Variable resistance element and method for fabricating the variable resistance element

A crossbar switch comprising: a first interconnect, a second interconnect, and a resistance change element. The resistance change element includes: a first electrode connected to the first interconnect and a second electrode connected to the second interconnect which are embedded in a first insulating film on a substrate having a transistor; a second insulating film covering the first insulating film and the first and second electrodes; first and second opening portions exposing parts of an upper surface including end portions of the first and second electrodes from the second insulating film with translational symmetry; first and second resistance change films covering the first and second opening portions and connecting to the first and second electrodes at the opening portions; third and fourth electrodes connecting to the first and second resistance change films; a fifth electrode connecting to the third and fourth electrodes and to a diffusion layer of the transistor.

Crossbar switch and method of manufacturing the same and semiconductor device

A crossbar switch includes a plurality of first wires extending in a first direction and second wires extending in a second direction. The switch includes third wires extending in a third direction and fourth wires extending in a fourth direction. The switch includes switch cells connected to the first and second wires. The first wires are skewed relative to the second and fourth wires, while the third wires are skewed relative to the second and fourth wires. The switch cells are connected to the third and fourth wires, and the third wires are also connected to the switch cells connected to the first wires adjacent to the respective first wires, or alternatively the fourth wires are also connected to the switch cells connected to the second wires adjacent to the respective second wires.

Crossbar switch with an arrangement of wires, logic integrated circuit using the same, and semiconductor device

A reconfigurable circuit includes first and second wires and two or more paths active at different times. Each path includes: a first NVRS whose first terminal is connected to the first wire; a first transistor whose drain terminal is connected to a second terminal of the first NVRS; a second NVRS whose first terminal is connected to the second terminal of the first NVRS; a second transistor whose source terminal is connected to a second terminal of the second NVRS and whose drain terminal is connected to the second wire; and a 2-input AND circuit whose output is connected to a gate terminal of the first transistor. A time control signal is supplied to a first input of the 2-input AND circuit and a gate terminal of the second transistor. A write control signal is supplied to a second input of the 2-input AND circuit.

Reconfigurable circuit

In switching elements each using a two-terminal-type variable resistance element, improper writing or any improper operation is often caused and the reliability of the switching elements cannot be improved easily. A switching element according to the present invention is equipped with a first variable resistance element equipped with a first input/output terminal and a first connection terminal, a second variable resistance element equipped with a second input/output terminal and a second connection terminal, and a rectifying element equipped with a control terminal and a third connection terminal, wherein the first connection terminal, the second connection terminal and the third connection terminal are connected to one another.

Switching element having overlapped wiring connections and method for fabricating semiconductor switching device

A variable resistance element according to the present invention comprises a configuration in which an ion conduction layer is arranged between an upper electrode and a lower electrode, wherein a recess part is formed on a surface of the lower electrode of the variable resistance element, and the ion conduction layer is formed in contact with at least the recess part on a surface of the lower electrode.

Variable resistance element, semiconductor device, and manufacturing method of semiconductor device

In the cases of performing programming by forming a two-terminal-type variable resistance element on a semiconductor device, it has been difficult to control the programming, and malfunctions have often occurred. This switching element includes at least a first variable resistance element, a second variable resistance element, a first rectifying element, and a second rectifying element, one end of the first variable resistance element and one end of the second variable resistance element are respectively connected to one end of the first rectifying element and one end of the second rectifying element, and each of the rectifying elements has two terminals.

Switching element, semiconductor device, and semiconductor device manufacturing method

In order to improve the number rewrites by improving the dielectric breakdown resistance of an ion conducting layer in a variable resistance element, this variable resistance element is provided with: a first electrode that contains at least copper; a second electrode that contains at least Ru, nitrogen and a first metal; and an ion conducting layer that is positioned between the first electrode and the second electrode.

Variable resistance element and method for producing variable resistance element

A semiconductor device comprises a semiconductor substrate; a multilevel wiring layer structure on the semiconductor substrate; and a variable resistance element in the multilevel wiring layer structure, wherein the variable resistance element comprises a variable resistance element film whose resistance changes between a top electrode and a bottom electrode, wherein the multilevel wiring layer structure comprises at least a wiring electrically connected to the bottom electrode and a plug electrically connected to the top electrode, and wherein the wiring also serves as the bottom electrode.

Growing community of inventors

Tokyo, Japan

Munehiro Tada