Stanley Electric Co., Ltd

Stanley Electric Corporation

Munehiro Kato

Naochika Horio

Masahiko Tsuchiya

Satoshi Tanaka

Shinichi Tanaka

Michihiro Sano

Kenichi Morikawa

Naochica Horio

Hiroyuki Sato

A semiconductor light emitting device includes a semiconductor layer having a recess extending downwardly from a top surface thereof along a pattern of a closed line so that said recess defines and encloses a region of the semiconductor layer that emits light, said semiconductor layer having a downward slope in at least a portion of its side end face located outside the closed line pattern of said recess; a first electrode on said downward slope of the side end face of the semiconductor layer and electrically in contact with a portion of said semiconductor layer, wherein said first electrode downwardly reflects light that is emitted by said semiconductor layer and that reaches the first electrode; and a second electrode electrically in contact with a portion of said semiconductor layer located inside the closed line pattern of said recess.

Semiconductor light emitting device with transparent substrate and reflective slope

A semiconductor light-emitting device can include a nitride semiconductor light-emitting layer and can supply a current to an entire light-emitting region quickly and efficiently to output high-intensity light. The semiconductor light-emitting device can include: a transparent substrate; a first conductivity type nitride semiconductor layer; a nitride semiconductor light-emitting layer; a second conductivity type nitride semiconductor layer; a notch region that cuts the second conductivity type nitride semiconductor layer and the nitride semiconductor light-emitting layer and exposes the first conductivity type nitride semiconductor layer, to define mesa active regions and a mesa electrode drawing region; an electrode for the first conductivity type; an ohmic electrode for the second conductivity type; and a supporting substrate including connecting members for the first and second conductivity types.

Semiconductor light-emitting device and fabrication method of the same

A semiconductor light emitting device can have stable electric characteristics and can emit light with high intensity from a substrate surface. The device can include a transparent substrate and a semiconductor layer on the substrate. The semiconductor layer can include a first conductive type semiconductor layer, a luminescent layer, a second conductive type semiconductor layer, and first and second electrodes disposed to make contact with the first and second conductive type semiconductor layers, respectively. The first conductive type semiconductor layer, the luminescent layer, and the second conductive type semiconductor layer can be laminated in order from the side adjacent the substrate. An end face of the semiconductor layer can include a first terrace provided in an end face of the first conductive type semiconductor layer in parallel with the substrate surface, and an inclined end face region provided nearer to the substrate than the first terrace. The first electrode disposed in the inclined end face region can reflect light emitted from the luminescent layer to the substrate.

Manufacturing method for semiconductor light emitting device

Semiconductor light emitting device and manufacturing method thereof

A semiconductor LED device includes: a transparent substrate stacked on which are an n-type nitride semiconductor layer, a nitride semiconductor light emission layer and a p-type nitride semiconductor layer; recess regions cutting the p-type layer and light emission layer and exposing the n-type layer, defining a plurality of mesa active regions and mesa electrode pull-up regions; an n-side electrode formed on the n-type layer in the recess surrounding the mesa active regions and extending onto the mesa electrode pull-up regions; a p-side electrode formed on the p-type layer of each of the mesa active regions; and a support substrate including n-side connection members connected to and facing the n-type electrodes and p-side connection members connected to and facing the p-side electrodes.

Semiconductor light emitting device on insulating substrate and its manufacture method

This invention aims to provide a white light emission diode arranged so that t rays emitted from an exciting element comprising a n-type semiconductor layer and a p-type semiconductor layer are converted by a wavelength converting element to white light which is then irradiated through molded resin. The white light emission diode offers a high color rendering effect desired for liquid crystal back light and minimizes deterioration of the molded resin to improve its light emission life characteristic. The wavelength converting element is provided on one surface of the exciting element and an insulating film is deposited on the other surface with interposition of a p-type ohmic electrode exhibiting a high reflectivity in UV wavelength band. The exciting element has its side surface covered with a n-type ohmic electrode exhibiting a high reflectivity in UV wavelength band.

Growing community of inventors

Tokyo, Japan

Munehiro Kato