Seiko Epson Corporation

Munehide Saimen

Eiju Hirai

Motoki Takabe

Katsutomo Tsukahara

Yoichi Naganuma

Masao Nakayama

Shuichi Tanaka

Tsuyoshi Yoda

Yasuyuki Matsumoto

Yoshiharu Ogata

Yoshikatsu Soma

Hiroharu Kondo

A MEMS device includes a wire that is formed of a conductive portion embedded into a recess opened in a first face of a substrate and a bump electrode that is electrically connected to the wire. A total width, in a second direction intersecting a first direction along which the wire extends on the first face, of an opening of the recess in a connection region where the wire and the bump electrode are electrically connected to each other is narrower than a width, in the second direction, of an opening of the recess in a region outside the connection region.

MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method

A piezoelectric device includes an actuator substrate that includes a plurality of piezoelectric element rows having a plurality of piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include a common electrodes common to the plurality of the piezoelectric elements. The actuator substrate includes a plurality of first common wirings connected to each of the common electrodes of the plurality of the piezoelectric element rows. The wiring substrate includes a plurality of second common wirings connected to each of the first common wirings of the plurality of piezoelectric element rows, and a plurality of auxiliary wirings buried in a groove portion formed in the wiring substrate. The auxiliary wirings are connected to each of the second common wirings, and the plurality of auxiliary wirings are not connected to each other.

Piezoelectric device, liquid ejecting head, and liquid ejecting apparatus

A MEMS device includes a first substrate in which a first electrode layer, a dielectric layer, and a second electrode layer are stacked on a driving region in this order; and a second substrate which is disposed to face a surface on which the dielectric layer of the first substrate is stacked. The first electrode layer and the dielectric layer extend beyond the second electrode layer toward a non-driving region separated from the driving region, a first resin having elasticity is disposed in a region including an end of the second electrode layer in an extending direction of the dielectric layer, and the first substrate and the second substrate are fixed with an adhesive in a state where the elastically deformed first resin is sandwiched therebetween.

MEMS device, liquid ejecting head, and liquid ejecting apparatus

A piezoelectric device includes an actuator substrate that includes a plurality of piezoelectric element rows having a plurality of piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include a plurality of individual electrodes disposed for each of the piezoelectric elements, and a common electrodes common to the plurality of piezoelectric elements. The wiring substrate includes a core portion disposed on a surface on the actuator substrate side, an individual wiring portion that partially covers the core portion, a common wiring portion that partially covers the core portion, and an auxiliary wiring disposed in a groove portion disposed on a first principal surface on the side opposite to the actuator substrate or on a second principal surface on the actuator substrate side. The auxiliary wiring is electrically connected to the common wiring portion. The individual electrode and the common electrode are respectively electrically connected to the individual wiring portion and the common wiring portion.

A piezoelectric device includes an actuator substrate that includes two rows of piezoelectric element rows piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include individual electrodes disposed for each of the piezoelectric elements, and a common electrode common to the piezoelectric elements. The wiring substrate includes a core portion disposed on a surface on the actuator substrate side, an individual wiring portion disposed for each of the piezoelectric element rows that partially covers the core portion, and a common wiring portion disposed for each of the piezoelectric element rows that partially covers the core portion. The two rows of piezoelectric element rows are respectively disposed so as to interpose the core portion. The individual wiring portion and the common wiring portion are respectively electrically connected to the individual electrode and the common electrode.

A MEMS device includes a plurality of movable regions, wiring lines extending along a first direction from the movable regions, and electrodes connected to the wiring lines. The electrodes include connection regions for connecting other electrode terminals to the connection regions. A plurality of the connection regions are disposed along a second direction intersecting the first direction. A distance between centers of connection regions that are adjacent in the second direction is longer than a distance between centers of movable regions that are adjacent in the second direction.

MEMS device and liquid ejecting head

A MEMS device includes a drive region having a stacked structural body in which a first electrode layer, a first dielectric layer, and a second electrode layer are stacked in that order. The stacked structural body extends from the drive region to a non-drive region that is outer than the drive region and, in an extending direction of the stacked structural body, the first electrode layer and the first dielectric layer extend farther outward than the second electrode layer. A second dielectric layer covering an end of the second electrode layer in the extending direction is stacked on the second electrode layer in the non-drive region and the first dielectric layer that is formed outer in the extending direction than the second electrode layer. A third electrode layer electrically connected to the second electrode layer is stacked on the second dielectric layer and on the second electrode layer in a region outside the second dielectric layer. In the extending direction, the end of the second electrode layer is formed more to a drive region side than a second dielectric layer-side end of the third electrode layer.

An electro-optic device includes: a liquid crystal panel which includes an element substrate, a facing substrate arranged so as to face the element substrate with a sealing material interposed therebetween, and a liquid crystal layer sealed in a region surrounded by the sealing material; and a mold which covers an outer circumference of the liquid crystal panel and functions as a mold, in which the mold covers a region, which is overlapped with at least a part of the sealing material in a plan view, from an end of the element substrate and an end of the facing substrate on a surface of the element substrate on an opposite side to the liquid crystal layer and a surface of the facing substrate on an opposite side to the liquid crystal layer, and in which a surface of the mold has liquid repellency.

Electro-optic device and electronic apparatus

In at least one embodiment of the disclosure, an electrooptic device includes first and second mounting terminals arranged on a terminal portion to be aligned in a direction intersecting with a side of the electrooptic substrate. A first flexible substrate is connected to the first mounting terminal. A second flexible substrate is connected to the second mounting terminal and arranged to be superimposed on the first flexible substrate. A resin member covers the first flexible substrate, the second flexible substrate and the electrooptic substrate.

Electrooptic substrate, electrooptic device, and electronic apparatus

A method for manufacturing a flexible substrate includes punching out a flexible substrate from a flexible tape wherein the flexible substrate has a first contour that is a part of a contour of the flexible substrate, and a second contour that is a remaining portion of the contour other than the first contour, and requires a punching accuracy lower than a punching accuracy of the first contour. The method includes the steps of: operating a first die by a control section to punch out the first contour from the flexible tape; judging by the control section as to whether a punching accuracy of the first contour meets a standard; and operating a second die by the control section to punch out the second contour from the flexible tape thereby separating the flexible substrate from the flexible tape when the control section judges that the punching accuracy of the first contour meets the standard, and not operate the second die when the control section judges that the punching accuracy of the first contour does not meet the standard.

Method for manufacturing flexible substrate and flexible substrate punching device

Disclosed herein is an electro-optical device including: an electro-optical panel including a first terminal portion having a first terminal and a second terminal and a second terminal portion having a third terminal and a fourth terminal, the first and the fourth terminal being electrically connected through a first connection wiring, the second and the third terminal being electrically connected through a second connection wiring; a first circuit substrate having a first external terminal connected to the first terminal and a second external terminal connected to the second terminal through a first connection terminal portion respectively; and a second circuit substrate having a third external terminal connected to the third terminal and a fourth external terminal connected to the fourth terminal through a second connection terminal portion respectively.

Electro-optical device, electro-optical panel, and electronic apparatus

An electro-optical device includes an electro-optical panel including a pair of first panel alignment marks having a first shape and a pair of second panel alignment marks having a second shape; a first circuit substrate provided with a first circuit substrate alignment mark which is represented by the first shape in plan view; and a second circuit substrate provided with a second circuit substrate alignment mark which is represented by the second shape in plan view.

Electro-optical device and electronic apparatus

A method of producing an electro-optical device for electrically connecting a first terminal portion provided on an electro-optical panel to a second terminal portion of a substrate includes applying an anisotropic conductive adhesive containing conductive particles made of a low-melting-point material onto either the first terminal portion or the second terminal portion, and electrically connecting the first terminal portion to the second terminal portion by eutectic bonding by melting the conductive particles by application of heat in thermocompression bonding of the second terminal portion to the first terminal portion with the anisotropic conductive adhesive therebetween.

Method of producing electro-optical device using anisotropic conductive adhesive containing conductive particles to bond terminal portions and electro-optical device

A method for manufacturing a wiring substrate having a sheet, including: (a) arranging a wiring substrate and a sheet between a board and a tool in a manner that a resin layer comes between the wiring substrate and the sheet, one surface of the wiring substrate being a concave/convex surface and the other surface being flat, and both surfaces of the sheet being flat; (b) pressing the wiring substrate, the resin layer, and the sheet using the board and the tool so as to adhere the resin layer to both the wiring substrate and the sheet, in that: the board having a flat surface is arranged in a manner that the flat surface faces the tool; the tool contains an elastic body having a projecting part projecting in a direction of the board; the resin layer is arranged so as to overlap with a concave part and a convex part of the concave/convex surface; and the pressing step (b) starts with a tip of the projecting part of the tool and the flat surface of the board and proceeds while expanding a pressing surface of the tool by widening a tip plane of the projecting part using deformation of the elastic body.

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Suwa, Japan

Munehide Saimen