Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Renesas Technology Corp.

Muneharu Tokunaga

Takakazu Fukumoto

Tetsuya Matsuura

Yasunori Ido

Hideaki Ohashi

A power conversion device includes: power conversion circuitry including a plurality of submodules connected in series to each other; a protection device generating a protection command for protecting each submodule; and one or more relay devices outputting the protection command to each submodule. The relay device includes: a first communication circuit for communicating with the protection device; and a second communication circuit for communicating with the power conversion circuitry. The first communication circuit transmits the stop command to the second communication circuit through a first communication channel, and transmits different information different from the stop command to the second communication circuit through a second communication channel. The communication speed of communication through the first communication channel is higher than that of communication through the second communication channel.

Power conversion device and communication method

A stacked semiconductor device structure comprising: a plurality of semiconductor modules each of which includes a substrate and at least one semiconductor device mounted on the substrate; a stacking device for stacking the semiconductor modules on one another; and a surface mount device for surface mounting on a further substrate for a system appliance the semiconductor modules stacked on one another by the stacking device.

Stacked semiconductor device structure

Semiconductor device

A memory module capable of changing the generation of semiconductor memory devices by changing the design of a unit board without changing the design of a mother board. The mother board has connection terminals having an ability of connecting with first and second generation type unit boards, so that even when a connection terminal location is changed as a result of the generation change of the semiconductor memory devices, the next unit board can be connected to the mother board by selecting an appropriate terminal from connection terminals on the mother board.

Memory module

Growing community of inventors

Tokyo, Japan

Muneharu Tokunaga