Intel Corporation

Mun Leong Loke

Weng Khoon Mong

Kang Eu Ong

Bok Sim Lim

A Vethanayagam Rudge

Sih Fei Lim

Suresh Ramalingam

Ravi V Mahajan

Nagesh K Vodrahalli

Michael J Costello

Tean Wee Ong

Yew Wee Cheong

Altaf Hasan

Eng Chiang Gan

Tean Wee One

Michael Keat Lye Lee

Soon Chuan Ong

Hooi Jin Teng

Lisa Yung Hui Lee

In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.

Flip chip assembly process for ultra thin substrate and package on package assembly

The present invention involves a method of providing an integrated circuit package having a substrate with a vent opening. The integrated circuit package includes a substrate having an opening and an integrated circuit mounted to the substrate. An underfill material is dispensed between the substrate and the integrated circuit.

Process for assembling an integrated circuit package having a substrate vent hole

A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.

Package warpage control

A method that includes, obtaining a substrate, placing a reinforcing layer over a first side of the substrate; and thinning the substrate by removing material from an opposite side of the substrate.

Method of thinning a wafer utilizing a laminated reinforcing layer over the device side

Integrated circuit package having a substrate vent hole

Growing community of inventors

Penang, Malaysia

Mun Leong Loke