Samsung Electronics Co., Ltd.

Sungkyunkwan University

Korea Advanced Institute of Science and Technology

Fine Semitech Co., Ltd.

Mun Ja Kim

Changyoung Jeong

Byungchul Yoo

Ji-Beom Yoo

Haeshin Lee

Seul-Gi Kim

Jibeom Yoo

Jang-dong You

Ji Beom Yoo

Sang-jin Cho

Yunhan Lee

Myung-shik Chang

Chang Young Jeong

Hwan Chul Jeon

Eokbong Kim

Jin Su Kim

Jin Sung Choi

Taesung Kim

Byung-Gook Kim

Byunggook Kim

Jongju Park

Hee-Bom Kim

Jaehyuck Choi

Sunghoon Park

Dong-Wook Shin

Hwan-Chul Jeon

Sooyoung Kim

Seulgi Kim

Sung Won Kwon

Jihoon Na

Hyunjune Cho

Jaewhan Sung

Sung-won Kwon

Chang-young Jeong

Hakseok Lee

Myeongjin Jeong

Jin Ho Yeo

Qicheng Hu

Ki Bong Nam

Dong Wook Shin

Kibong Nam

Kijung Son

Jinho Yeo

A method of fabricating a pellicle structure includes forming a metal layer on a temporary substrate, forming a membrane on the metal layer, exposing a bottom surface of the metal layer by separating the temporary substrate from the metal layer, and exposing a bottom surface of the membrane by etching the exposed bottom surface of the metal layer.

Method of fabricating pellicle structure

An adhesive composition, a method for preparing the same, a reticle assembly including the same, and a method for fabricating the reticle assembly including the same are provided. The adhesive composition includes a polyphenol compound including tannic acid, a polymer including polyvinyl alcohol, and a solvent including water and alcohol.

Adhesive composition, method for preparing the same, reticle assembly including the same, and method for fabricating reticle assembly including the same

An adhesive for a pellicle, the adhesive including a phenol compound, the phenol compound having at least two hydroxyl groups, a polymer having a hydroxyl group or an amine group, and water.

Adhesive for pellicle, pellicle for photo mask and method for manufacturing the same

A stud attachment device for attaching a plurality of studs to a photomask constituting a reticle. The stud attachment device including a body; a plurality of holders extending from the body, the holders allowing the studs to be laid thereon, respectively; and a pressure regulator for independently controlling pressures of the holders when the studs are attached to the photomask.

Stud attachment device and stud attachment method with independent temperature/pressure control

An apparatus for generating extreme ultraviolet (EUV) light includes a raw material supply unit supplying a plasma source for generating EUV light. An EUV light source unit uses a laser to generate plasma from the plasma source. A filter is configured to extract EUV light from the light. A first protective layer is disposed on a front surface of the filter. A frame having a first region exposing at least a portion of the filter or the first protective layer is disposed on the first protective layer. A width of the first region is smaller than a width of the first protective layer and smaller than or equal to a width of the filter.

Apparatus for generating extreme ultraviolet (EUV), method of manufacturing the same, and EUV system

A pellicle transfer apparatus includes; a base including supporting a target plate, a pellicle and a flexible plate sequentially stacked on the base, and a roller unit laterally movable in a first direction across the base and including a lower roller extending in a second direction intersecting the first direction, and an upper roller above the lower roller and extending in the second direction, wherein the lower roller compresses the flexible plate while the roller unit laterally moves in the first direction across the base to bond the pellicle to the target plate, as the pellicle is separated from the flexible plate, and the flexible plate moves upward to wrap around the lower roller, and the upper roller contacts the flexible plate as it wraps around the lower roller.

Pellicle transfer apparatus and method

A pellicle for a photomask comprises a pellicle membrane. The pellicle membrane incudes a base layer having a first surface and a second surface facing the first surface, and a first recovery layer covering the first surface of the base layer. A content of SP2 covalent bonds between carbon atoms contained in the first recovery layer is less than or equal to a content of SP2 covalent bonds between carbon atoms contained in the base layer.

Pellicle for photomask and method of fabricating the same

Methods of manufacturing a pellicle assembly may include forming a sublimable support layer on a first surface of a pellicle membrane, attaching a pellicle frame to a second surface of the pellicle membrane while the sublimable support layer is on the first surface of the pellicle membrane, and sublimating the sublimable support layer while the pellicle frame is attached to the pellicle membrane. In order to manufacture a photomask assembly, a photomask is fixed to the pellicle frame such that the photomask faces the pellicle membrane with the pellicle frame therebetween.

Methods of manufacturing pellicle assembly and photomask assembly

An EUV lithography apparatus may include a light source, an EUV mask and a carbon-based optical filter. The light source may generate an EUV light. The EUV mask may be configured to apply the EUV light to a photoresist film on a substrate. The carbon-based optical filter may filter a light having an OoB wavelength in the EUV light. Thus, the EUV light may not include the light having the OoB wavelength to decrease an error of a photoresist pattern formed using the EUV light.

Extreme ultraviolet lithography apparatus

A pellicle for a photomask comprises a pellicle membrane. The pellicle membrane includes a base layer having a first surface and a second surface facing the first surface, and a first recovery layer covering the first surface of the base layer. A content of SP2 covalent bonds between carbon atoms contained in the first recovery layer is less than or equal to a content of SP2 covalent bonds between carbon atoms contained in the base layer.

Provided is a pellicle for exposure to extreme ultraviolet light (EUVL) according to an example embodiment, and the pellicle includes a pellicle membrane; and a frame attached to the pellicle membrane, wherein the pellicle membrane includes a carbon-based main layer that has a first surface and a second surface, which are two surfaces opposite to each other; and a boron-based enhancement layer covering at least one surface selected from the first surface and the second surface. The pellicle according to an example embodiment may be used for an extended period of time in an extreme ultraviolet light exposure environment.

Pellicle for exposure to extreme ultraviolet light, photomask assembly, and method of manufacturing the pellicle

A pellicle film for extreme ultraviolet (EUV) lithography includes a graphite-containing thin film.

Pellicle film including graphite-containing thin film for extreme ultraviolet lithography

A method for fabricating a semiconductor device includes forming a pellicle including an amorphous carbon layer, attaching the pellicle onto a reticle, and forming a photoresist pattern by utilizing EUV light transmitted through the pellicle and reflected by the reticle. The forming the pellicle includes forming a first dielectric layer on a first side of the substrate, forming the amorphous carbon layer on the first dielectric layer, forming a second dielectric layer on a second side of the substrate opposite to the first side of the substrate, etching the second dielectric layer overlapping the first region of the substrate to form a mask pattern, and forming a support including the second region of the substrate and the remaining part of the first dielectric layer. The forming the support includes etching the first region of the substrate and the first dielectric layer on the first region.

Method for fabricating semiconductor device

A reticle may be fabricated and inspected. The reticle, which may include thin patterns, may be selectively incorporated into a fabricated semiconductor device based on measurement information generated based on the inspecting. The inspecting may include forming thin patterns on a substrate, forming a first discharge layer on the thin patterns, and directing a first charged particle beam to the substrate, such that the first charged particle beam passes through the first discharge layer. Measurement information may be generated based on the first charged particle beam. The first discharge layer may connect the thin patterns to each other and may be separated from the substrate between the thin patterns.

Pattern inspection methods and methods of fabricating reticles using the same via directing charged particle beams through discharge layers

Growing community of inventors

Suwon-si, South Korea

Mun Ja Kim