Hewlett-packard Development Company, L.P.

Hewlett Packard Enterprise Development LP

Mun Hoong Tai

Martin Goldstein

Hau Jiun Chen

Choon Pheng Tan

Chee Kit John Chan

Kum Cheong Adam Chan

Foo Luen Wong

Tatt Hoong Chow

See Yun Yow

Rex Dael Navarro

Song Poh Chai

Khai Chiah Chng

Su Nee Chin

Siang Aun Yeoh

Examples discussed herein relate to managing power allocation for devices, such as network devices, with processing chip. In some examples, based on determining that a first temperature measurement of the processing chip does not satisfy an operating temperature threshold, the network device allocates power from a power source to a first heating element of the network device to heat the processing chip & allocates power from the power source to a second heating element of the network device to heat the processing chip. Based on determining that a second temperature measurement satisfies the operating temperature threshold, the network device allocates power from the power source to a set of power over ethernet ports of the network device & the first amount of power from the power source selectively to the first heating element to heat the processing chip.

Power allocation to heat a processing chip of a network device

Example implementations relate to an insertion key assembly for a pluggable module. The insertion key assembly includes a stopper element having a stopping tab, a biasing element, and a driver element having a driving tab. The biasing element is connected to the stopper element and the driver element. In a relaxed state of the biasing element: i) the stopper element is pushed outwards by the biasing element to protrude the stopping tab into a passageway defined by a plurality of walls of a chassis, to block insertion of the pluggable module inside the passageway, and ii) the driver element is pushed outwards by the biasing element to protrude the driving tab into adjacent passageway. In a biased state of the biasing element, the stopper element is pulled inwards by the biasing element to retract the stopping tab from the passageway to allow insertion of the pluggable module inside the passageway.

Chassis having an insertion key assembly for a pluggable module

A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card.

Serial connection riser cards including parallel connection memory modules

A computer system detects that it is coupled to a pedestal having a cooling fan. The computer system signals the cooling fan of the pedestal to operate, and signals cooling fans within the computer system to operate at lower rotational speeds having lower acoustic levels.

Providing cooling to a computer system via a pedestal having a cooling fan

A baffle is provided proximate an array of fans used to cool electronic components. The baffle may assume different orientations with respect to the array of fans.

System and method for orienting a baffle proximate an array of fans that cool electronic components

Serial connection external interface riser cards avoidance of abutment of parallel connection external interface memory modules

Growing community of inventors

Singapore, Singapore

Mun Hoong Tai