Xilinx, Inc.

Stats Chippac Pte. Ltd.

Mukul Joshi

Kumar Nagarajan

Rajendra D Pendse

Venkatesan Murali

Chien Ouyang

A method of manufacture of an integrated circuit packaging system includes: providing an interposer having an interposer first side and an interposer second side opposing the interposer first side; mounting an integrated circuit to the interposer first side, the integrated circuit having a non-active side and an active side with the non-active side facing the interposer; connecting first interconnects between the active side and the interposer first side, the first interconnects having a first density on the interposer first side; mounting the interposer over a package carrier with the interposer first side facing the package carrier; connecting second interconnects between the package carrier and the interposer second side, the second interconnects having a second density on the interposer second side, the second density that is approximately the same as the first density; and forming an encapsulation over the package carrier covering the interposer and the second interconnects.

Integrated circuit packaging system with interconnect and method of manufacture thereof

A method of manufacture of an integrated circuit system includes: providing a substrate having a transistor and a metallization layer; forming a metal pad in direct contact with the metallization layer of the substrate; forming a passivation layer in direct contact with the metal pad and covering the substrate; forming a routing trace above the passivation layer in direct contact with the metal pad, and the routing trace is substantially larger than the metal pad, and the routing trace is not electrically insulated by a subsequent layer; and forming a bump connected to the metal pad with the routing trace.

Integrated circuit system with stress redistribution layer and method of manufacture thereof

A method of implementing a discrete component in an integrated circuit package is described. The method includes steps of coupling the discrete component to a surface of a substrate of the integrated circuit package, coupling an integrated circuit die to the surface of the substrate, applying a first epoxy material, and applying a second epoxy material to the discrete component, where the first epoxy material is different from the second epoxy material.

Method of implementing a discrete element in an integrated circuit

A method of implementing a capacitor in an integrated circuit package is disclosed. The method comprises coupling the capacitor to a first surface of a substrate of the integrated circuit package; positioning an integrated circuit die over the capacitor, wherein the integrated circuit die has a first plurality of solder bumps and a second plurality of solder bumps separated by a region having no solder bumps; coupling the integrated circuit die to the first surface of the substrate over the capacitor, wherein the region having no solder bumps is positioned over the capacitor; and encapsulating the integrated circuit die and the capacitor.

Method of implementing a capacitor in an integrated circuit

An integrated circuit package has a substrate; a discrete capacitor coupled to a first surface of the substrate; an integrated circuit die coupled to the first surface of the substrate over the discrete capacitor; and a lid coupled to the substrate, the lid encapsulating the integrated circuit die and the discrete capacitor.

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Mountain View, CA, United States of America

Mukul Joshi