Lsi Logic Corporation

Mukul A Joshi

Mohan R Nagar

Sarathy Rajagopalan

A packaged integrated circuit including a package substrate having electrical contacts for receiving an integrated circuit. The integrated circuit is electrically connected to the electrical contacts of the package substrate. A stiffener is mounted to the package substrate, where the stiffener has a non-orthogonal cut out in which the integrated circuit is disposed. The edges of the cut out are disposed at no greater a distance from the corners of the integrated circuit than they are from the sides of the integrated circuit.

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Santa Clara, CA, United States of America

Mukul A Joshi