Osram Sylvania Inc.

Muktesh Paliwal

David L Houck

Nelson E Kopatz

Sanjay Sampath

Leonid P Dorfman

Michael J Scheithauer

James R Spencer

Frank J Venskytis

Gail T Meyers

A W&mdash;Cu&mdash;Ni alloy having thermophysical properties suitable for use in electrical contacts and electrodes is described. The alloy is formed by direct sintering of a powder blend comprising a tungsten-copper composite powder and a nickel powder. The tungsten-copper composite powder component of the blend comprises individual dual phase particles having a copper phase and a tungsten phase wherein the tungsten phase substantially encapsulates the copper phase. The method for direct sintering the W&mdash;Cu&mdash;Ni alloy substantially eliminates the formation of brittle intermetallics and slumping during sintering.

Alloy for electrical contacts and electrodes and method of making

A high performance W--Cu composite powder which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.

Tungsten-copper composite powder

A method of making flowable tungsten/copper composite powder by milling an aqueous slurry of a mixture of the desired weight ratio of tungsten powder and copper oxide powder and, optionally, a small amount of cobalt powder, spray-drying the slurry to form spherical, flowable agglomerates, and reducing the agglomerates in a hydrogen atmosphere.

Method of making flowable tungsten/copper composite powder

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Owego, NY, United States of America

Muktesh Paliwal