Siemens Aktiengesellschaft

Siemens Microelectronics Limited

Muk Wai Lui

Walter Wegleiter

Ernst Nirschl

Olaf Schoenfeld

Semiconductor chips are produced from a wafer. The semiconductor chips are separated from one another by etching the wafer all the way through, by a dry etching process, in defined separation zones between the semiconductor chips. Initially, first etching trenches for separating the p-n junctions are etched into the wafer. Then, second etching trenches are etched from the opposite side of the wafer until the individual semiconductor chips are completely separated.

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Milpitas, CA, United States of America

Muk Wai Lui