Semes Co., Ltd.

Muhyeon Lee

Kyounghwan Kim

Gui Su Park

Byungsun Bang

Jungbong Choi

Sul Lee

Ye Jin Choi

Myung A Jeon

Kangseop Yun

Youngil Lee

Soyoung Park

Dae Min Kim

Seung Eun Na

Inryu Jeon

Yeonju Lee

An apparatus for processing a substrate may include a drain box for receiving a solution drained in a predetermined process, a drain line for discharging the solution from the drain box to an outside, and at least one spray member for providing a gas and/or a liquid to block an air flowed into the drain box and/or to control a humidity in the drain box.

Apparatus for processing a substrate and method of processing a substrate

Embodiments of the inventive concept described herein relate to an apparatus and method for removing an adhesive exposed to the outside from an object being processed. The apparatus for removing the adhesive exposed to the outside from an edge region of the object being processed, in which the object has a patterned substrate and a support plate bonded together by the adhesive. The cover liquid nozzle dispenses the cover liquid onto a cover area of a top surface of the object other than the exposed area, and the controller controls the cover liquid dispensing member to adjust a flow rate of the cover liquid to cause a removal rate of the adhesive to remain constant.

Apparatus and method for processing substrate

An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a liquid supply unit for supplying treating liquid to the substrate supported on the support unit, and a heating unit disposed in the support unit for heating the substrate supported on the support unit, wherein the heating unit includes a plurality of lamps to heat the substrate, and a window disposed above the lamps to transmit light emitted from the lamps, wherein the window includes a base in a form of a plate, and light adjustment means formed on the base to spread or converge light emitted from the lamps.

Substrate treating apparatus

An apparatus and a method for treating a substrate with liquid are disclosed. The substrate treating apparatus comprises a substrate supporting unit for supporting the substrate, a liquid supply unit for supplying a liquid to the substrate supported on the substrate supporting unit, and a controller for controlling the liquid supply unit, wherein the liquid supply unit comprises a first nozzle for supplying a first liquid and a second nozzle for supplying a second liquid, and a second area where the second liquid is supplied on the substrate is provided within a first area where the first liquid is supplied on the substrate. The first liquid and the second liquid supplied with a hydrophobic film are discharged with different ways from each other. Thereby, particles with various sizes may be removed depending on each discharge methods.

Apparatus and method for treating a substrate

Growing community of inventors

Cheonan-si, South Korea

Muhyeon Lee