Applied Materials, Inc.

Muhammad M Rasheed

Muhannad Mustafa

Rongjun Wang

Xianmin Tang

Srinivas Gandikota

Dmitry Lubomirsky

Keith A Miller

Alan A Ritchie

Mario Dan Sanchez

Thanh X Nguyen

Kirankumar Neelasandra Savandaiah

Donny Young

Zhendong Liu

Xinglong Chen

Sudhir R Gondhalekar

Ilker Durukan

Uday Pai

Ellie Y Yieh

Tza-Jing Gung

Zhong Qiang Hua

Qiwei Liang

Yixiong Yang

Yong Cao

Cheng-Hsiung Matt Tsai

Wei V Tang

Yu Wen Chang

Padmanabhan Krishnaraj

Siqing Lu

Vikash Banthia

Tony Kaushal

Anqing Cui

William Kuang

John C Forster

Anantha K Subramani

Avgerinos V Gelatos

Michael Santiago Cox

Lara Hawrylchak

Tom K Cho

Yu Lei

Wei D Wang

Mingwei Zhu

Xinyu Fu

Ananthkrishna Jupudi

Canfeng Lai

Omkaram Nalamasu

Zhenbin Ge

Thanh Ngoc Pham

Goichi Yoshidome

Kevin Vincent Moraes

Hemant P Mungekar

Vivek Agrawal

Ryan Hanson

Guoqiang Jian

Ravi Jallepally

Deepak Jadhav

Dinesh Saigal

Steven H Kim

Robert Chen

Victor H Calderon

Shi Wei Toh

Weiyi Luo

Yung-Hsin Lee

Praburam Gopal Raja

Anindita Sen

Mei Yin Chang

Nag B Patibandla

Paul F Ma

Dien-Yeh Wu

Young Seen Lee

Martin Lee Riker

Kadthala Ramaya Narendrnath

Adolph Miller Allen

Siamak Salimian

Xiaoxiong Yuan

Steven Victor Sansoni

Jallepally Ravi

Balasubramanian Ramachandran

Hamid Tavassoli

Jianxin Lei

Shih Chung Chen

William R Johanson

Lei Zhou

Kenric T Choi

Manjunatha P Koppa

Tatsuya E Sato

Srinivasa Rao Yedla

Ashutosh Agarwal

Bruno Geoffrion

Faruk Gungor

Kevin A Papke

Steve Sansoni

Harry S Whitesell

William Fruchterman

Andrew V Le

Zhigang Xie

Robert Duncan

Jing Zhou

Rudolf Gujer

Vinod Konda Purathe

Xiping Huo

Embodiments of the present disclosure generally relate to an apparatus for improving the film thickness on a substrate when using a heated substrate support. A cover plate to be placed over the top surface of a heated substrate support is disclosed. The cover plate includes a pocket formed in the middle thereof for the placement of a substrate. The cover plate may include a variety of features including a plurality of dimples, a plurality of radially disposed grooves, a plurality of annular grooves, lift pin holes, pin slots, and gas exhaust holes.

Heater cover plate for uniformity improvement

Methods and apparatus for processing substrates are provided herein. In some embodiments, a process kit for a substrate support includes: an upper edge ring made of quartz and having an upper surface and a lower surface, wherein the upper surface is substantially planar and the lower surface includes a stepped lower surface to define a radially outermost portion and a radially innermost portion of the upper edge ring.

Process kit for a substrate support

Process chamber lids having a pumping liner with a showerhead and gas funnel within an open central region are described. The showerhead is spaced a distance from the gas funnel to form a gap and the gas funnel has an opening to provide a flow of gas into the gap. The gas funnel includes a plurality of apertures extending from the front surface to a common region adjacent the back surface of the gas funnel. A purge ring is in contact with the back surface of the gas funnel and aligned so that a circular channel formed in the bottom surface of the purge ring body is positioned adjacent the common area of the apertures in the gas funnel.

ALD cycle time reduction using process chamber lid with tunable pumping

Embodiments of multi-zone showerheads are provided herein. In some embodiments, a multi-zone showerhead includes: a body having an outer surface and including a plurality of fluidly independent plenums; and a plurality of gas distribution plugs extending through the body, wherein at least one gas distribution plug includes a first internal gas passageway coupling a first plenum of the plurality of fluidly independent plenums to the outer surface and a second internal gas passageway coupling a second plenum of the plurality of fluidly independent plenums to the outer surface. In some embodiments, the body can include: a top plate; a bottom plate; and one or more intermediate plates disposed between the top plate and the bottom plate, wherein individual plenums of the plurality of fluidly independent plenums are respectively defined between adjacent plates of the top plate, the bottom plate, and the one or more intermediate plates.

Multi-zone showerhead

Apparatus for processing a substrate are provided herein. In some embodiments, a lid for a substrate processing chamber includes: a lid plate comprising an upper surface and a contoured bottom surface, the upper surface having a central opening and the contoured bottom surface having a first portion that extends downwardly and outwardly from the central opening to a peripheral portion of the lid plate and a second portion that extends radially outward along the peripheral portion of the lid plate; an upper flange extending radially outward from the lid plate; and one or more channels formed through the lid plate from the upper surface of the lid plate to the second portion of the contoured bottom surface.

Lids and lid assembly kits for atomic layer deposition chambers

Methods and apparatus for physical vapor deposition are provided herein. In some embodiments, a process kit shield for use in a physical vapor deposition chamber may include an electrically conductive body having one or more sidewalls defining a central opening, wherein the body has a ratio of a surface area of inner facing surfaces of the one or more sidewalls to a height of the one or more sidewalls of about 2 to about 3.

Methods and apparatus for reducing sputtering of a grounded shield in a process chamber

Gas distribution assemblies and process chambers comprising gas distribution assemblies are described. The gas distribution assembly includes a gas distribution plate, a lid and a primary O-ring. The primary O-ring is positioned between a purge channel of a first contact surface of the gas distribution plate and a second contact surface. Methods of sealing a process chamber using the disclosed gas distribution assemblies are also described.

High temperature vacuum seal

Process chamber lids, processing chambers and methods using the lids are described. The lid includes a pumping liner with a showerhead, blocker plate and gas funnel positioned therein. A liner heater is positioned on the pumping liner to control temperature in the pumping liner. Gas is flowed into the gas funnel using a dead-volume free one-way valve with a remote plasma source.

High temperature chemical vapor deposition lid

Pumping liners for process chambers including a first ring-shaped body and a second ring-shaped body are described. The first ring-shaped body has a first plurality of openings and the second ring-shaped body has a second plurality of openings. The first ring-shaped body and the second ring-shaped body are rotatable relative to each other around a central axis to at least partially overlap the first plurality of openings and the second plurality of openings to change the area of conductance through the openings. Methods of removing gases from a processing chamber are also described.

Pumping liner for improved flow uniformity

Connector assemblies for holding two tubes together and methods of use are described. The connector assemblies have an inner bolt, a split outer bolt comprising at least two outer bolt sections and a clamp bolt. The clamp bolt holds the outer bolt sections together to form the split outer bolt and the inner bolt is screwed into the outer bolt to enclose the two tube ends.

Apparatus and methods to prevent particle entry into gas lines

Methods and apparatus to reduce pressure fluctuations in a chemical delivery system for a process chamber are provided herein. In some embodiments, a chemical delivery system for a process chamber, includes: a carrier gas supply; an ampoule fluidly coupled to the carrier gas supply via a first supply line, wherein the ampoule is configured to supply one or more process gases to the process chamber via a second supply line; an inlet valve disposed in line with the first supply line to control a flow of a carrier gas from the carrier gas supply to the ampoule; and a first control valve disposed in line with a pressure regulation line, wherein the pressure regulation line is fluidly coupled to the first supply line at a tee location between the carrier gas supply and the inlet valve.

Methods and apparatus to reduce pressure fluctuations in an ampoule of a chemical delivery system

Embodiments of a slip ring for use in a rotatable substrate support are provided herein. In some embodiments a slip ring includes a main body having a top wall, a bottom wall, and a sidewall extending between the top and bottom walls, wherein the top wall, bottom wall, and sidewall define an inner volume within the main body, wherein a central opening is formed through the top wall; a plurality of annular containers disposed within the inner volume and coaxially with the main body, wherein the plurality of annular containers are vertically spaced apart from one another, and wherein each of the plurality of annular containers contains a first volume of an electrically conductive liquid; an upper cylindrical body rotatably disposed in the central opening; a lower cylindrical body fixedly coupled to the lower wall of the main body.

Slip ring for use in rotatable substrate support

Gas distribution assemblies and process chamber comprising gas distribution assemblies are described. The gas distribution assembly includes a gas distribution plate, a lid and a primary O-ring. The primary O-ring is positioned between a purge channel of a first contact surface of the gas distribution plate and a second contact surface. Methods of sealing a process chamber using the disclosed gas distribution assemblies are described.

Growing community of inventors

San Jose, CA, United States of America

Muhammad M Rasheed