Applied Materials, Inc.

Muhammad Azim Bin Syed Sulaiman

Arvind Sundarrajan

Guan Huei See

Sriskantharajah Thirunavukarasu

Prayudi Lianto

Karthik Elumalai

Mohamed Rafi

Ang Yu Xin Kristy

Methods and apparatus for producing fine pitch patterning on a substrate. Warpage correction of the substrate is accomplished on a carrier or carrier-less substrate. A first warpage correction process is performed on the substrate by raising and holding a temperature of the substrate to a first temperature and cooling the carrier-less substrate to a second temperature. Further wafer level packaging processing is then performed such as forming vias in a polymer layer on the substrate. A second warpage correction process is then performed on the substrate by raising and holding a temperature of the substrate to a third temperature and cooling the substrate to a fourth temperature. With the warpage of the substrate reduced, a redistribution layer may be formed on the substrate with a 2/2 &#x3bc;m l/s fine pitch patterning.

Methods and apparatus for controlling warpage in wafer level packaging processes

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Singapore, Singapore

Muhammad Azim Bin Syed Sulaiman