Industrial Technology Research Institute

Muh-Wang Liang

Jen-Rong Huang

Tzong-Ming Wu

Kuan-Chou Chen

Chen-Chung Du

Pang-Min Chiang

Fu-Ching Tung

Tean-Mu Shen

Jung-Chen Chien

Sheng-Lang Lee

Ping-Yu Hu

Chih-Yuan Tseng

Pang-Ming Chiang

Yi-Jiun Lin

Yi-Chao Weng

Chia-Hao Chang

Chih-Yung Huang

Edward Yi Chang

Chih-Cheng Wang

Ching-Chiun Wang

Ching-Fa Yeh

Chun-Kai Huang

Kuei-Jung Chen

Lang-Fu Tsai

Chia-Ming Chen

Pei-Shan Wu

Wu-Lang Lin

Jung-Chen Ho

Tung-Fang Yang

Jiann-Cherng Chen

Chih-Hung Liu

Sheng-Fu Tsai

Chen Max

Cheng-Yao Lin

Kuang-Yuan Hung

Li-Wei Chen

Sui-Bin Horng

Shih-Ming Chiang

Shen-Bin Wu

Yi-Hsiu Tseng

A deposition apparatus including a chamber having a deposition area and a non-deposition area, a gas intake device communicated with the chamber, a gas annulus disposed in the chamber and surrounding the gas intake device, a carrier disposed in the deposition area and a retaining annulus disposed in chamber and surrounding the carrier. The gas intake device is disposed corresponding to the deposition area and configured to draw a process gas into the deposition area. The gas annulus is configured to generate an annular gas curtain in the deposition area. The carrier carries a deposited object, wherein the gas annulus is located between the gas intake device and the carrier. The deposited object is surrounded by the annular gas curtain. The retaining annulus has a plurality of through holes. The retaining annulus is located between the gas annulus and the carrier.

Deposition apparatus

A solidifying device is for solidifying a substrate which includes a middle and two side portions. The thermostability of the middle portion is greater than that of the side portions. The solidifying device includes a housing, a heating member, a temperature control air-floating member and a conveyor. The housing defines a working space. The heating member is in the working space. The substrate has a heat receiving surface facing the heating member. The temperature control air-floating member is in the working space and below the heating member. The conveyor is for transporting the substrate into the working space and between the temperature control air-floating member and the heating member. The heating member is for providing heat to the substrate. The temperature control air-floating member is for supplying air towards the substrate to allow the substrate to float in the working space and form a high-temperature and two low-temperature areas.

Solidifying device

A plasma generator, a surface treatment method using the same, and a surface treatment method using the same for bio-tissue are provided. The plasma generator comprises a plasma tube, a reaction source tube, a first electrode and a second electrode. The plasma tube has a plasma outlet. The reaction source tube is disposed within the plasma tube, and has a reaction outlet. The first electrode and the second electrode are disposed on the plasma tube, wherein the second electrode is closer to the plasma outlet than the first electrode is. The plasma outlet of the reaction source is not projected beyond a lower portion of the first electrode.

Plasma generator, surface treatment method using the same and surface treatment method using the same for bio-tissue

A method for depositing a microcrystalline silicon film is disclosed, including performing an open loop and close loop plasma enhanced deposition process without and with modulating process parameters, respectively. A film is deposited by the open loop plasma enhanced deposition process till a required film crystallinity and then performing a closed loop plasma enhanced deposition process which monitors species plasma spectrum intensities SiH* and H&#x3b1; and modulates process parameters of the plasma enhanced deposition process resulting in the species concentration stabilization which controls the intensities variation of SiH* and H&#x3b1; within an allowed range of a target value for improving film depositing rate.

Method for depositing microcrystalline silicon and monitor device of plasma enhanced deposition

A cathode discharge device is provided. The cathode discharge apparatus includes an anode, a cathode and plural cathode chambers. The cathode is located inside the anode, where the cathode has plural flow channels and at least one flow channel hole, and the plural flow channels are connected to one another through the flow channel hole. The plural cathode chambers are located inside the cathode, wherein each of the cathode chambers has a chamber outlet and a chamber inlet connected with at least one of the flow channels.

Cathode discharge apparatus

A wafer electroplating apparatus with a function of bubble removal includes an electroplating bath main body and a fixing device. The electroplating bath main body has an inlet device, a first de-bubble tank and at least an air hole. The fixing device has a second de-bubble tank and an outer shell. The air hole guides gathering bubbles to an outside of the electroplating bath main body so as to remove bubbles. The fixing device can be put into the first de-bubble tank within the electroplating bath main body to form a de-bubble area and is separated easily therefrom to clean the wafer electroplating apparatus. The electroplating bath main body further includes a baffle for rectifying electroplating solution flow before entering the inlet device.

Wafer electroplating apparatus

The present invention relates to a compress and position apparatus with positioning, orientating functions and providing more uniform pressing force compliantly. The compress and position apparatus comprises a guiding column, a base, a housing, a seat, a annular portion and a pressing plate. The base has a cylinder, a plurality of locating pins and a convex portion. The annular portion has a through hole and a plurality of locating holes. The guiding column and the cylinder are disposed in the housing provided with an opening for the guiding column passing therethrough. The housing is mounted on the base and passed through a through hole of the annular portion and disposed in a cavity of the seat. A plane on the housing abuts a plane on the cavity to prevent the rotation of the housing. The guiding column is combined with the seat. The locating pin is inserted into the locating hole. The pressing plate engages the annular portion. Thus the guiding column is moved up and down by the gas supply device. The convex portion biases the pressing plate to exert force on the substrate.

Compress and position apparatus

The present invention proposes an apparatus for loading and unloading wafers to and from the semiconductor fabrication equipment. The present invention uses two U-shaped port plate supporters of high rigidity to respectively join with drive devices such as lead screws, shaft bearings, and a lead device, and then join with components such as a port plate, a port door, and a base. The assembly is driven by a motor via timing pulleys, timing belts, idle wheels, a pair of lead screws, shaft bearings, and a lead device. An encoder is matched for feedback control. Thereby, accurate positioning of the main mechanism of the wafer pod responsible for upward and downward movement can be achieved so as to increase the accuracy and reliability of positioning transfer of wafers. Secondarily, the contamination of particles resulted from the motion of the main mechanism can be reduced by using an intake filtering system. Because the present invention adopts a modular design, the drive source of each unit is isolated and the circuit of each unit is hidden so that the whole structure is most compact and the assembling/disassembling and maintenance are easier.

Apparatus for loading/unloading wafers to and from semiconductor fabrication equipment

A method for low temperature liquid-phase deposition and a method for cleaning a liquid-phase deposition apparatus are disclosed. The method for low temperature liquid-phase deposition is employed so as to form a low-temperature grown film or a film with excellent step-coverage on the surface of a semiconductor device having independent circuit functions. The method for cleaning liquid-phase deposition apparatus is characterized in that a loop used exclusively for cleaning is employed so as to prevent SiO powders from remaining in the loop.

Method for low temperature liquid-phase deposition and method for cleaning liquid-phase deposition apparatus

A wafer loading system positioning method and device, comprising a loading system, having a base and a rear plate for docking on a positioning frame of a production equipment. The main characteristic thereof is that the loading system in an upper part of the rear plate has a holding seat and the positioning frame in an upper part of a front side has an upward extending positioning element. Two eccentric cams on the holding seat and the positioning element allow to adjust a relative position of the holding seat with respect to the positioning element. A lifting mechanism enables raising of the loading system for lifting said holding seat above said positioning element, so as to enable said holding seat to engage with said positioning element.

Wafer loading system positioning method and device

The present invention provides a fabricating process for forming multi-layered metal bumps by electroless plating, comprising the steps of: providing an IC chip or a semiconductor substrate on which there are provided a plurality of pads; dispensing a first dielectric layer, exposing the pads, roughing the surface to be redistributed by chemical or physical approaches, activating the surface in order to follow-up electroless plating deposition advantageously, and dispensing a second dielectric layer so as to define a redistribution path; depositing a conductive film on the redistribution path by electroless plating, in which the conductive film allows the positions of the pads to be changed so as to be connected to the external circuit; forming a photoresist pattern, exposing a plurality of pre-determined positions on the conductive film so as to redistribute the positions for the metal bumps formed later; performing activation on the pre-determined positions so as to generate an activator; forming initial metal bumps of a pre-determined thickness on the pads by electroless plating; removing the photoresist pattern, completely exposing the metal bumps; dispensing a third dielectric layer, having a thickness less than the height of the metal bumps and a window more than the size of the metal bumps, so as to expose the metal bumps; and forming a peripheral metal layer covering the periphery of the metal bumps, in which the conductivity and the RF characteristics of the peripheral metal layer are better than those of the metal bumps so as to be electrically connected to the conductive film.

Fabricating process for forming multi-layered metal bumps by electroless plating

A method for liquid phase deposition, including the steps of providing at least two raw materials from at least two supply devices of a saturation reaction system into a mixture trough and stirring until saturation occurs, filtering out unnecessary solid-state particles, and providing saturated and filtered liquid into an over-saturation reaction trough of a steady-flow over-saturation loop reaction system and stopping the saturated and filtered liquid when the over-saturation reaction trough is filled and the saturated and filtered liquid over-flows into a liquid level control trough to a pre-determined level. The method also includes the steps of providing a substrate in the over-saturation reaction trough, providing reactants from at least two supply devices into the over-saturation reaction trough, and depositing a thin film onto the substrate when the saturated liquid becomes over-saturated.

Method for liquid phase deposition

A Modified door for wafer container, includes a rotatable cammed member, two first links coupled to the rotatable cammed member and vertically aligned and moved in and out of respective first latch holes on the wafer transport module upon rotary motion of the rotatable cammed member, and two second links respectively coupled to the first links and horizontally moved in and out of respective second latch holes on the wafer transport module upon movement of the first links. The links each have a slope adapted to be moved with the respective link over a respective bearing means of the door body to force the door body inwards against the wafer transport module, keeping the wafer transport module well sealed.

Door for wafer container having rotatable cammed member and movable links

A personal guided transport vehicle is disclosed to include a horizontal motion unit, a vertical motion unit, and a gear set coupled between a shaft of the horizontal motion unit and a shaft of the vertical motion unit for enabling the shafts to be interlocked. When operating a horizontal operating lever of the horizontal motion unit, a lock pin is forced into engagement with a mounting hole of the shaft of the vertical motion unit. The horizontal motion unit and the vertical motion unit each have a spring plunger for self-lock. A docking mechanism is disclosed to enable the vehicle to be easily positioned in a docking flange. The docking mechanism includes a locating plate and a coupling plate, the locating plate having a locating notch for quick alignment, the coupling plate having hooks for hooking on the docking flange to hold the vehicle in position.

Personal guided transport vehicle

A resin plunging apparatus for molding resin to seal an electronic device, in which a ball screw is rotated to move a movable base plate and two load elements at the movable base plate, enabling a plunger holder which is supported on the load elements to be moved with the movable base plate along guide bars, so that plungers which are securely mounted on the plunger holder are positively smoothly forced into cavities in upper and lower molds to plunge resin tablets.

Growing community of inventors

Miaoli County, Taiwan

Muh-Wang Liang