Intel Corporation

Muffadal Mukadem

Jeffory L Smalley

Ralph V Miele

Sriram Srinivasan

Thomas A Boyd

Kuang C Liu

Eric W Buddrius

Steven A Klein

Shelby A Ferguson

Luis Gil Rangel

Francis Toth, Jr

An electronic device may include a circuit board, and the circuit board may include a dielectric material. A socket may be coupled to a first side of the circuit board, and the socket may be configured to receive a semiconductor package. A backing plate may be positioned on a second side of the circuit board. A spacer may be positioned between the backing plate and the circuit board. The spacer may alter the profile of the socket to provide a curved profile to the socket. The spacer may displace a portion of the socket in a first direction, for instance when the spacer is coupled between the backing plate and the circuit board.

Electronic device, socket, and spacer to alter socket profile

Growing community of inventors

Portland, OR, United States of America

Muffadal Mukadem