Auras Technology Co., Ltd.

Mu-Shu Fan

Chien-Yu Chen

Chien-An Chen

Che-Chia Chang

Yi-Wun Chen

An-Chih Wu

Ming-Yuan Chiang

Yu-Ting Chang

Wan-Chi Hsiao

Chien-Chih Su

Hung-Yi Kuo

Kuan-Cheng Lu

Hsin-Chang Chen

Chia-Chen Wang

Hsing-Pao Yu

Yen-Ling Liu

Chie-Sheng Lim

Ming-Chieh Li

Shih-Chieh Kao

A liquid cooling device includes a water cooling radiator, a first pump and a cold plate. The water cooling radiator has a first surface and a second surface, the first surface and the second surface are located on opposite sides of the water cooling radiator, the first pump is disposed on the first surface or the second surface of the water cooling radiator, and the cold plate is disposed on the second surface of the water cooling radiator.

Liquid cooling device

A cold plate is provided and includes: a casing formed with an accommodating groove; a base coupled to the casing to define an action space together with the casing, where the action space communicates with the accommodating groove; a heat transfer structure disposed on an inner side of the base for transferring a heat energy generated by a heat source in contact with an outer side of the base to a working medium in the action space; and a pump having a stator disposed in the accommodating groove.

Cold plate

A heat dissipation device is provided and includes: a casing; a base unit combined with the casing to form a water collecting chamber, a water inlet chamber, an action space and a water outlet chamber; a heat transfer structure disposed on an inner side of the base unit; a water inlet pipeline unit communicated with the water collecting chamber; a water outlet pipeline unit communicated with the water outlet chamber; and a pump unit disposed outside the casing and the base unit, and connected with the water inlet pipeline unit and the water outlet pipeline unit, so as to drive a working medium.

Heat dissipation device

A liquid cooling head includes an upper casing, an impeller, a bottom casing and a skived fin cooling plate. The upper casing has an inlet and an outlet, the upper casing is fixed on the bottom casing, and the impeller is arranged between the upper casing and the skived fin cooling plate. In addition, the skived fin cooling plate is fixed on the bottom casing, and the impeller sucks the heat-dissipating liquid from the inlet and drives the heat-dissipating liquid passing through the skived fin cooling plate, upwardly passing through the impeller and then discharged from the outlet.

Liquid cooling head with a heat dissipating liquid flowing from a cooling plate to an impeller

A dynamic nameplate is provided, which includes: a base disposed on a circuit board; and a rotating member disposed on the base through a bearing, so that the rotating member can rotate relative to the base. The dynamic nameplate can provide dynamic effects without using a conventional motor.

Dynamic nameplate

A water cooling head includes water cooling head includes a casing, a base and a pump. The casing includes an inlet and an outlet. An outer side of the base has a heat-absorbing surface. A thermal conduction structure is disposed on an inner side of the base. An active space is defined by the base and the casing collaboratively. The pump includes a first magnetic element, a second magnetic element, an impeller and a pivotal part. The first magnetic element is located outside the active space. The first magnetic element is arranged between the impeller and the base along a direction perpendicular to the base. The pivotal part, the second magnetic element and the impeller are disposed within the active space. The pivotal part is connected with the impeller and arranged between the impeller and the base. The second magnetic element is installed on the pivotal part.

Water cooling head

A water-cooling head includes a casing, a base, a thermal conduction structure and a pump. An active space is defined by the base and the casing collaboratively. A working medium is filled in the active space. The pump includes a fixing element, a shaft and an impeller. After the fixing element is fixed, the fixing element is contacted with the base or contacted with the thermal conduction structure, and the shaft is fixed on the fixing element. Consequently, the impeller is stably rotated about the shaft, and the performance and the reliability of the water-cooling head are enhanced.

Water-cooling head

A water-cooling head includes a casing, a base, an input channel, an output channel and a pump. An active space is defined by the base and the casing collaboratively. A working medium is filled in the active space. The heat absorbed by the base is transferred to the working medium. The input channel is in communication with the active space. The cooled working medium is introduced into the active space through the input channel. The output channel is in communication with the active space. The heated working medium is outputted from the active space through the output channel. The pump is installed on the casing, and includes an impeller. The impeller is disposed within the active space and located near the output channel. The impeller is driven to guide the working medium to be outputted from the active space through the output channel.

A pump module includes a main body, a first pump and a second pump. The main body includes a fluid channel, a first mounting hole and a second mounting hole. The fluid channel is exposed through the first mounting hole and the second mounting hole. The first pump is installed in the first mounting hole and sealedly coupled with the first mounting hole. The second pump is installed in the second mounting hole and sealedly coupled with the second mounting hole. A working liquid in the fluid channel is transferred through the first pump and the second pump sequentially. Even if one of the first pump and the second pump is damaged, the other of the first pump and the second pump is normally operated to move the working liquid in the fluid channel.

Pump module having two impellers in series and a multiple plate housing

A heat dissipation system and a coolant distribution module for plural electronic components of an electronic computing device are provided. The heat dissipation system includes plural water-cooling heads, a heat dissipation device and the coolant distribution module. When a fluid medium flows through the heat dissipation device, the heat dissipation device exchanges heat with the fluid medium. The coolant distribution module is connected between the plural water-cooling heads and the heat dissipation device. The coolant distribution module includes a main body and a power module. The module main body includes a cooled fluid chamber. The cooled fluid chamber includes plural first outlets corresponding to the plural water-cooling heads. The power module is installed in the module main body. The power module drives the fluid medium to be outputted from the plural first outlets. Consequently, the fluid medium is transferred through a circulating loop.

Heat dissipation system and coolant distribution module thereof

Water cooling device

An electronic device with a heat-dissipating function and a liquid-cooling radiator module are provided. The electronic device includes a first circuit board, a second circuit board and a liquid-cooling radiator module. The second circuit board is mounted on the first circuit board. The liquid-cooling radiator module is attached on the second circuit board and in thermal contact with an electronic component of the second circuit board. The liquid-cooling radiator module includes plural airflow channels and a fan. The plural airflow channels are in parallel with the second circuit board. The fan produces airflow toward the plural airflow channel. After the airflow passes through the plural airflow channels, the airflow is outputted in a direction parallel with the second circuit board. Since the airflow is not obstructed by the adjacent function circuit boards, the heat-dissipating efficiency is enhanced.

Electronic device with heat-dissipating function and liquid-cooling radiator module thereof

A clustered heat dissipation device and a chassis are provided. The clustered heat dissipation device includes a heat-absorbing manifold, plural heat-absorbing heads and plural connection pipes. The heat-absorbing manifold includes an inlet chamber and an outlet chamber. The inlet chamber includes at least one first liquid inlet and plural first liquid outlets. The outlet chamber includes plural second liquid inlets and at least one second liquid outlet. The heat-absorbing manifold is in thermal contact with a first heat source. The plural connection pipes are connected with the heat-absorbing heads and the corresponding first liquid outlets and connected with the heat-absorbing heads and the corresponding second liquid inlets.

Clustered heat dissipation device and chassis with same

A water-cooling heat dissipating system includes a pump and a water-cooling head. The water-cooling head includes a base, a first chamber and a second chamber. The base is in contact with an electronic component. The first chamber and the second chamber are located over the base and separated from each other. The first chamber includes a first inlet and a first outlet. The first inlet is in fluid communication with the pump. The second chamber includes a second inlet and a second outlet. The second inlet is fluid communication with the first outlet. The liquid continuously flows through the first chamber and the second chamber. The heat from the electronic component is transferred to the liquid within the first chamber and the second chamber through the base, and released through the first outlet and the second outlet.

Water-cooling heat dissipating system and water-cooling head

A water-cooling heat dissipation module includes a hot-water heat exchange structure, a cold-water heat exchange structure, a fluid communication structure and a fan. The fluid communication structure is in communication with the hot-water heat exchange structure and the cold-water heat exchange structure. The fan and the hot-water heat exchange structure are opposed to each other with respect to the cold-water heat exchange structure. An airflow produced by the fan blows the cold-water heat exchange structure and the hot-water heat exchange structure sequentially. Consequently, the cold-water heat exchange structure will not receive the heat from the hot-water heat exchange structure through the airflow.

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Taipei, Taiwan

Mu-Shu Fan