Samsung Electronics Co., Ltd.

Mu-kyeng Jung

Byung-jun Oh

Kyung-tae Lee

Ju-Youn Kim

Hyun-Jo Kim

Hyun-Min Choi

Hee-Sung Kang

Ki-Chul Park

Bai-Sun Kong

Sun-Jung Lee

Hyuk-Ju Ryu

Kyung-soo Kim

Soon-Kyun Shin

Jae-Whui Kim

Woo-young Chung

A pumping capacitor is provided. The pumping capacitor includes a substrate, a P-type gate layer on the substrate, and a gate dielectric layer between the substrate and the P-type gate layer. The substrate includes an N-type well region and an N-type doping region in the N-type well region.

Pumping capacitor

A method of forming a wiring layer of a semiconductor device, includes forming a first interlayer insulating layer to have a first thickness corresponding to a part of the thickness of an interlayer insulating layer that is to be formed on a support layer and forming a first contact plug in the first interlayer insulating layer. The method further includes forming a second interlayer insulating layer to have a second thickness on the first contact plug and the first interlayer insulating layer, thereby forming the interlayer insulating layer, wherein the second thickness corresponds to the rest of the thickness of the interlayer insulating layer, and forming a second contact plug connected to the first contact plug in the second interlayer insulating layer, thereby forming a local wiring layer including the first contact plug and the second contact plug.

Method of forming wiring layer of semiconductor device

Integrated circuit devices include an integrated circuit substrate and a conductive lower electrode layer of a capacitor on the integrated circuit substrate. A dielectric layer is on the lower electrode layer and a conductive upper electrode layer of the capacitor is on the dielectric layer. A first intermetal dielectric layer is on the upper electrode layer. The first intermetal dielectric layer includes at least one via hole extending to the upper electrode layer. A first conductive interconnection layer is on the at least one via hole of the first intermetal dielectric layer. A second intermetal dielectric layer is on the first intermetal dielectric layer. The second intermetal dielectric layer includes at least one via hole extending to the first conductive interconnection layer and at least partially exposing the at least one via hole of the first intermetal dielectric layer. A second conductive interconnection layer is provided in the at least one via hole of the second intermetal dielectric layer that electrically contacts the first conductive interconnection layer.

Integrated circuit devices including a capacitor

A regulated cascode circuit includes a first MOS transistor of a first conductive type, a second MOS transistor of the first conductive type, a third MOS transistor of a second conductive type, a first current source and a second current source. The first MOS transistor is coupled between an output node and a first node. The second MOS transistor having a gate terminal for receiving a bias voltage is coupled between the first node and a second power supply voltage. The third MOS transistor is coupled between the first power supply voltage and a gate terminal of the first MOS transistor. The first current source is coupled between the gate terminal of the first MOS transistor. The second current source is coupled between the first power supply voltage and the output node.

Regulated cascode circuits and CMOS analog circuits including the same

A regulated cascode circuit includes a first PMOS FET and a second PMOS FET connected in series between a first terminal that receives a first supply voltage and an output terminal, a first NMOS FET and a second NMOS FET connected in series between the output terminal and a second terminal that receives a second supply voltage, and a regulation circuit. The regulation circuit outputs a first control signal for stabilizing a voltage at a drain of the first PMOS FET to a gate of the second PMOS FET based on a voltage of the drain of the first PMOS FET and outputs a second control signal for stabilizing a voltage change in a source of the first NMOS FET to a gate of the first NMOS FET based on a voltage of the source of the first NMOS FET.

Regulated cascode circuit, an amplifier including the same, and method of regulating a cascode circuit

A complementary metal oxide semiconductor (CMOS) device having improved performance includes a first device active region including at least one pair of transistor active regions wherein one transistor active region has a first width and the other transistor active region for forming a contact has a second width, a first gate arranged on the first device active region, a MOS transistor of a first conductivity type including a source/drain region of the first conductivity type formed in the first device active region, a second device active region having a third width greater than the first width, a second gate arranged on the second device active region, and a MOS transistor of a second conductivity type including a source/drain region of the second conductivity type formed in the second device active region.

CMOS device with improved performance and method of fabricating the same

Integrated circuit devices include an integrated circuit substrate and a conductive lower electrode layer of a Metal-Insulator-Metal (MIM) capacitor on the integrated circuit substrate. A dielectric layer is on the lower electrode layer and a conductive upper electrode layer of the MIM capacitor is on the dielectric layer. A first intermetal dielectric layer is on the upper electrode layer. The first intermetal dielectric layer includes at least one via hole extending to the upper electrode layer. A first conductive interconnection layer is on the at least one via hole of the first intermetal dielectric layer. A second intermetal dielectric layer is on the first intermetal dielectric layer. The second intermetal dielectric layer includes at least one via hole extending to the first conductive interconnection layer and at least partially exposing the at least one via hole of the first intermetal dielectric layer. A second conductive interconnection layer is provided in the at least one via hole of the second intermetal dielectric layer that electrically contacts the first conductive interconnection layer.

Growing community of inventors

Suwon-si, South Korea

Mu-kyeng Jung