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Mouhanad Chaker

Roger J Clark

James S Hayes

An improved wire enamel consisting essentially of the following materials by weight wherein basis is wire enamel weight; at least 50% by wt. of a polar organic solvent; about 2-8% by wt. of a polyimide precursor which can be cured to yield a polyimide polymer; about 0.5 to about 25% by weight of the substituted aliphatic hydrocarbon solvent for the polyimide precursor having a surface tension and polarity greater than that of the halogenated aliphatic hydrocarbon described below or a substituted aromatic hydrocarbon having a dipole moment less than or equal to the dipole moment of the halogenated aliphatic hydrocarbon described below; about 5 to 40% by wt. of a halogenated aliphatic hydrocarbon; and 0 to about 1% by wt. of an organosilane which increases the adhesion of the polyimide to an underlying substrate.

High flash point/low surface energy solvent systems for polyimide

Process for depositing latexes having a net electrical charge on metal surfaces without the application of electrical current, preferably by the generation of the metal cation at the surface of the metal in a bath containing hydrogen peroxide and an organic acid which forms negatively-charged or neutral complexes with that particular metal ion.

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Burlington, VT, United States of America

Mouhanad Chaker