Murata Manufacturing Co., Ltd.

Motoyuki Okeshi

Makoto Irie

Takashi Hashimoto

Koichi Nitta

Satoru Hachinohe

Yasuo Otowaki

Takashi Iwamoto

Michinobu Maesaka

Choichiro Fujii

Hidemasa Iwami

Hiroyuki Kawakami

Ken Taniguchi

Tetsuya Mori

A paste application apparatus capable of evenly applying a paste to each of the front portion and the rear portion of a coating target with a simple operation. The paste application apparatus includes a setting device for setting the velocity difference between the movement velocity of the target and that of a paste layer during application of the paste in order to evenly apply the paste to the front portion and the rear portion. The paste layer having a constant layer thickness on a substrate surface moves along an arc-shaped path, when viewed from the side, the target for coating moves along the tangential direction of the arc-shaped path at a constant velocity while being immersed to a predetermined depth relative to the paste layer, and thereby the paste is applied to the target for coating.

Paste application apparatus and method for applying paste

An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element. Input and output lead terminals are connected to the electrodes on the substrate, while a grounding lead terminal is connected to the cap.

Method of making an electronic component

A piezoelectric component prevents development of a short circuit between separate electrodes of a piezoelectric element and provides a high level of connection reliability. The piezoelectric component includes a piezoelectric element utilizing a longitudinal oscillation mode and being mounted on a mounting substrate. The piezoelectric element has on one main surface thereof a first electrode and a second electrode formed by dividing electrode material via longitudinally extending linear grooves and, on the other main surface, a third electrode. Conductive support members are secured to node sections of the first and second electrodes so as to be spaced apart from each other with respect to the longitudinal dimension of the piezoelectric substrate. The support members are adhered to and secured to pattern electrodes of the mounting substrate by conductive adhesive.

Method of producing piezoelectric component

A piezoelectric element prevents the development of a short circuit between separate electrodes and provides a high level of connection reliability. The piezoelectric element utilizing a longitudinal oscillation mode includes a piezoelectric substrate which has on one main surface thereof a first electrode and a second electrode separated by longitudinally extending linear grooves and, on the other main surface, a third electrode. Conductive support members are secured to node sections of the first and second electrodes so as to be spaced apart from each other with respect to the longitudinal dimension of the piezoelectric substrate.

Growing community of inventors

Shiga-ken, Japan

Motoyuki Okeshi