Hitachi Metals, Ltd.

Motoyuki Itoh

Shinichi Kazui

Masanori Ochiai

Takahiro Kinoshita

Kenichi Kubo

Shinji Takane

A multi-core cable core aligning device is composed of a temporary holding mechanism, which is configured to arrange tips of a plurality of cores exposed at one end of a multi-core cable in a row along a predetermined arranging direction, and temporarily hold each one of the plurality of cores in such a manner as to be movable along the predetermined arranging direction, a transferring mechanism, which is configured to transfer the plurality of cores one by one while separating the plurality of cores held by the temporary holding mechanism one by one from other ones of the plurality of cores, and an aligning mechanism, which is configured to align and hold the plurality of cores with a predetermined space between adjacent ones of the plurality of cores while holding the plurality of cores transferred by the transferring mechanism one by one at spaced intervals.

Multi-core cable core alignment device and multi-core cable core alignment method

A molten metal supply cylinder for melting a low melting point metallic material in a solid phase and supplying the molten metal material, including a melting section to be directly or indirectly brought into contact with a low melting point metallic material to produce molten metal, and a substantially tubular flow path that has a first opening formed at an end thereof in the melting section and a second opening at the other end thereof and allows the molten metal produced in the melting section to flow. An oxide of the surface layer of the low melting point metallic material is removed by an oxide removing section before the low melting point metallic material is molten in the melting section.

Molten metal supply cylinder, molten metal supply apparatus incorporating such a supply cylinder and molten metal supply method

An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arrangement member has one surface, another surface opposite to the one surface of the arrangement member and positioning openings, wherein the positioning openings are arranged corresponding to the pattern such that the openings are through from the one surface to the another surfaces of the arrangement member so that the balls are inserted therein. The another surface of the arrangement member is positioned opposite to the one surface of the base unit. The arrangement member has two or more line members of which the core axes are substantially aligned. The transfer device is arranged in a manner that the line members are substantially in a horizontal position to contact with the balls supplied to one surface of the arrangement member, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the base unit through the positioning openings.

Method and apparatus for placing conductive balls

Improved placing method and apparatus are provided for placing conductive balls in a predetermined pattern onto one surface of a base unit. An arrangement member is provided to have one surface, another surface opposite to the one surface of the arrangement member and positioning openings The positioning openings are arranged corresponding to the pattern so that the balls are inserted therein. The another surface of the arrangement member is opposite to the one surface of the base unit. The arrangement member has two or more line members whose core axes are substantially aligned. The transfer device is arranged so that the line members are substantially in a horizontal position to contact with the balls, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the base unit through the positioning openings.

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Tokyo, Japan

Motoyuki Itoh