Hitachi-kokusai Electric Inc.

Kokusai Electric Corporation

Motoya Takewaki

Tetsuya Kosugi

Akihiro Osaka

Hideto Yamaguchi

Tokunobu Akao

Masaaki Ueno

Atsushi Umekawa

Hitoshi Murata

Tomoshi Taniyama

Masashi Sugishita

A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.

Substrate processing apparatus, and thermocouple

Described herein is a technique capable of improving a uniformity of a semiconductor manufacturing process by placing a substrate at an appropriate position on the basis of actual installation dimensions of a reaction tube. According to one aspect of the technique, there is provided a substrate processing apparatus including: a boat on which substrates are placed; a process furnace including a reaction tube into which the boat is to be inserted, wherein a film is formed on the substrates placed on the boat in the reaction tube; and a substrate transport device configured to transfer the substrates into the boat, wherein the substrates are transferred into the boat by the substrate transport device referring to a virtual center axis of the reaction tube measured in advance.

Substrate processing apparatus and method of manufacturing semiconductor device

A substrate processing apparatus includes a reaction tube processing a substrate, a heating part disposed on an outside of the reaction tube that heats the interior of the reaction tube, an insulating part disposed on an outside of the heating part, a plurality of flow channels installed in the insulating part and allows an air or a cooling medium to flow, and a ceiling part configured to cover an upper surface of the insulating part. The ceiling part includes a first member having a supply hole formed to communicate with the flow channels and to supply the air or cooling medium into the flow channels, and a second member having a space formed between the second member and the first member and allowing the air or the cooling medium to flow therein and having a partition part to partition the space into at least two spaces.

Substrate processing apparatus including heating and cooling device, and ceiling part included in the same

A ceiling heat insulator installed above a side wall heat insulator of a heating apparatus for a substrate processing apparatus for processing a substrate is provided. The ceiling heat insulator includes a gas-flow path installed therein to allow a cooling gas to pass therethrough so that the ceiling heat insulator has a solid cross-sectional area in an outer edge side of the ceiling heat insulator that is smaller than that in a center side of the ceiling heat insulator.

Substrate processing apparatus, heating apparatus, ceiling heat insulator, and method of manufacturing semiconductor device

Heater of substrate processing apparatus

Thermometry tool for substrate processing apparatus

Reaction tube

A heat insulation structure, which has a cylindrical side wall part formed in a multilayer structure, includes: a cooling gas supply port provided in an upper portion of a side wall outer layer disposed in an outer side of the side wall part; a cooling gas passage provided between a side wall inner layer disposed in an inner side of the side wall part and the side wall outer layer; a space provided in an inner side of the side wall inner layer; a plurality of blowout holes provided in the side wall inner layer for distributing cooling gas from the cooling gas passage to the space; a buffer area continuously provided in the cooling gas supply port and the cooling gas passage; and a throttle part configured to reduce a cross-sectional area of a boundary surface between the buffer area and the cooling gas passage.

Insulation structure and method of manufacturing semiconductor device

Protector tube for thermocouple

Growing community of inventors

Toyama, Japan

Motoya Takewaki