Hitachi, Ltd.

Hitachi Cable, Inc.

Renesas Northern Japan Semiconductor, Inc.

Motoya Ishida

Hajime Hasebe

Atsushi Fujisawa

Makoto Aida

Yasuhiro Kashimura

Yoichi Kinouchi

A semiconductor device having a seal member of insulative resin, tab suspension leads and leads exposed to the mounting surface of the seal member, a semiconductor element located in the seal member and fixed by an adhesive of the tab surface, and conductive wires for electrically connecting electrodes of the semiconductor element to the leads. At least a lead portion of the leads has an inverted trapezoid-like section configured of a upper surface embedded in the seal member, a lower surface exposed from the seal member, and side surfaces connecting the two side edges of the upper and lower surfaces. Two side edges of the upper surface are formed with machined surfaces, respectively, having one end connected to the upper surface and the other end connected to side surfaces. The machined surfaces are formed by the pressing process in different directions of extension with the upper and side surfaces.

Semiconductor device and its manufacturing method with leads that have an inverted trapezoid-like section

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Hitachi, Japan

Motoya Ishida