Dow Corning Toray Silicone Company Limited

Dow Corning Corporation

Dow Corning Toray Company, Ltd.

Daikin Industries, Ltd.

Dow Corning (shanghai) Co Ltd

Motoshi Sasaki

Yoshitsugu Morita

Katsutoshi Mine

Takashi Nakamura

Akihiko Kobayashi

Kiyotaka Sawa

Hideki Kobayashi

Toru Masatomi

Satoshi Onodera

Peter Cheshire Hupfield

Masahiko Maeda

Zhihua Liu

Tetsuya Masutani

Shoji Akamatsu

Masaru Nagato

Michael Wolfgang Backer

Yasuo Itami

Mari Wakita

Pierre Chevalier

Eiji Kitaura

Kaori Ozawa

Vincent Rerat

Takeshi Yoshizawa

Ana Marques

Ikutaro Morikawa

To provide a coating agent composition that cures to form a transparent film that exhibits a high water repellency, a high durability, and an excellent adhesiveness to substrate. A coating agent composition that characteristically comprises (A) an acrylic copolymer obtained by the radical copolymerization of (A1) 1 mole silane compound represented by the general formula: CH&#x2550;C(R)&#x2014;COO-Q-SiR(OR), (A2) 3.70 to 6.20 moles of at least one compound that contains a vinyl polymerizable unsaturated bond, and (A3) 1.05 to 1.80 moles of a siloxysilane compound represented by general formula (2): CH&#x2550;C(R)&#x2014;COO-Q-Si(OSiR)at an molar ratio (A1)/{(A1)+(A2)+(A3)}=0.11 to 0.17; and (B) a condensation reaction catalyst.

Coating agent composition

There is provided a polyester coating composition having excellent action of preventing deposition of outdoor stain and stain caused by rainfall, being capable of extending a period of time (pot life) from the mixing to the coating, and comprising (A) a polyester resin, (B) one or more of fluorine-containing organosilicon compounds having a fluorine content of 5 to 30% by mass, (C) one or more of aliphatic hydrocarbon compounds having hydroxyl group and 1 to 10 carbon atoms, in which a part of hydrogen atoms bonded to carbon atom may be substituted by fluorine atoms and/or one or more of alkoxy compounds having 2 to 10 carbon atoms, in which a part of hydrogen atoms bonded to carbon atom may be substituted by fluorine atoms, and (D) an organic solvent.

Coating composition

Branched silicone (organopolysiloxane) resins and preparation method and use thereof are provided, which contain at least one group selected from phosphonate and phosphinate groups and at least one organic group containing nitrogen. Such silicone resins can be used in thermoplastic, thermosetting or rubber organic polymer compositions to reduce the flammability of the organic polymer compositions.

Silicone resins and their use in polymer compositions

Disclosed is a high energy ray-curable composition which is excellent in storage stability before curing and enables to form a cured coating film which is excellent in hardness, property of preventing adhesion of fats and oils, property of wiping off fats and oils, abrasion resistance, transparency, water repellency, adhesion, smoothness and uniformity. Specifically disclosed is a high energy ray-curable composition containing the following components (A)-(D). (A) 100 parts by weight of a polyfunctional acrylate (B) 1-30 parts by weight of an organoalkoxysilane having an aliphatic unsaturated bond (C) 1-100 parts by weight of colloidal silica (D) 0.2-20 parts by weight of a fluorine compound having an aliphatic unsaturated bond.

High energy ray-curable composition

A coating agent composition of the present invention consists of: (A) an acrylic-type copolymer that has a weight-average molecular weight within the range of 3,000 to 100,000 and contains in its side molecular chains hydrolysable silyl groups of the following formula: &#x2014;COO-Q-SiR(OR)and organosiloxysilyl groups of the following formula: &#x2014;COO-Q-Si(OSiR); and (B) a condensation-reaction accelerating catalyst. Prior to curing, the composition demonstrates excellent storage stability and coating properties, while after curing the composition produces a coating film of high hardness that has excellent water-repellent properties and durability.

A film-forming silicone resin composition, comprising a reaction product obtained by a method comprising the step of heating (A) an alkoxysilyl-functional organopolysiloxane obtained by running an equilibration reaction with components comprising (A1) a polydiorganosiloxane and (A2) an alkylpolysilicate in the presence of (A3) an equilibration polymerization catalyst; (B) colloidal silica, aluminum oxide, antimony oxide, titanium oxide, or zirconium oxide; and (C) water, and a curable film-forming silicone resin composition, comprising above film-forming silicone resin composition and (E) a condensation reaction catalyst.

Film-forming silicone resin composition

Liquid alkoxysilyl-functional silicone resins having excellent storage stability and a method of preparing these liquid alkoxysilyl-functional silicone resins comprising running an equilibration polymerization reaction with components comprising (A) a polydiorganosiloxane and (B) an alkyl polysilicate in the presence of (C) an equilibration polymerization catalyst. Curable silicone resin compositions comprising the aforesaid liquid alkoxy-functional silicone resins which have excellent curability and when cured form a water-repellent coating on a variety of substrate surfaces.

Liquid alkoxysilyl-functional silicone resins, method for their preparation, and curable silicone resin compositions

A water repellent silicone coating agent composition comprising (A) a diorganopolysiloxane having a viscosity of 20 to 20,000 mPa&middot;s at 25&deg; C. in which the terminal ends of the molecular chain are blocked by silanol groups or silicon-bonded hydrolyzable groups, (B) a cross-linking agent represented by general formula R SiX , in which R is a monovalent hydrocarbon group comprising 1 to 10 carbon atoms, X is a hydrolyzable group, and subscript a is an integer of 0 to 2, (C) a condensation reaction catalyst, (D) a hydrophobic surface treated dry process silica having a carbon content of 3.7 to 5% by weight and a bulk density of 40 to 99 g/L, or a hydrophobic surface treated dry process silica having a carbon content of 2.7 to 5% by weight and a bulk density of 100 to 300 g/L, (E) an organic functional silane coupling agent-based adhesion-imparting agent, (F) an organic solvent, and optionally (G) a non-reactive silicone fluid.

Water repellent silicone coating agent composition

Method for forming insulating thin films

A method for forming thin films on substrates wherein the films are produced by applying a solution of an electrically insulating, heat-curing resin onto the substrate, evaporating the solvent and exposing the resin to high energy radiation to cure the resin. The resin solution contains a substance selected from solvents and gas generating additives that causes the dedensification of the film during the cure of the resin. This results in a film having a dielectric constant of below 2.7. A semiconductor device is also disclosed as having an interconnect structure including at least one electrically conductive layer with an interposed insulating layer having a dielectric constant of less than 2.7 wherein the insulating layer is produced by the method described above.

Semiconductor device and method for the fabrication thereof

A curable silicone resin composition contains (A) 100 parts by weight of a silicone resin having condensation-reactive group, (B) 1 to 100 parts by weight of an inorganic fine powder, (C) 0.5 to 50 parts by weight of a silazane compound; and (D) an arbitrary amount of an organic solvent. The curable silicone resin composition cures to form a cured coating film with excellent water-repellent properties.

Curable silicone resin composition

This invention pertains to a method for forming thin films on substrates wherein the films are produced by applying a solution of an electrically insulating, heat-curing resin onto the substrate, evaporating the solvent and exposing the resin to high energy radiation to cure the resin. The resin solution contains a substance selected from solvents and gas generating additives that causes the dedensification of the film during the cure of the resin. This results in a film having a dielectric constant of below 2.7. This invention also pertains to a semiconductor device having an interconnect structure comprising at least one electrically conductive layer with an interposed insulating layer having a dielectric constant of less than 2.7 wherein the insulating layer is produced by the method of this invention.

The instant invention pertains to a composition that can form silica thin films, wherein said composition performs well as a substrate planarizing coating when applied to a substrate and can be converted by exposure to high-energy radiation into silica thin film with an excellent electrical insulating performance. The composition for the formation of silica thin films comprises (A) a hydrogen silsesquioxane resin that contains at least 45 weight % hydrogen silsesquioxane resin with a molecular weight no greater than 1,500; and (B) solvent. A silica thin film is produced by evaporating the solvent (B), and then converting at least a portion of the hydrogen silsesquioxane resin (A) to silica by exposing the surface of the said substrate to high-energy radiation. The preferred substrate is a semiconductor substrate having at least one electrically conductive layer.

Method for the formation of silica thin films

To provide a composition and process for forming insulating films that can produce insulating films having low dielectric constants. The composition comprises (A) an electrically insulating curable inorganic or organic resin, (B) a solvent, and (C) at least one solvent-soluble substance (excluding the solvent used for component (B)) that upon heating or by interaction with the resin (A) can generate gas or undergo volatilization in the temperature range from 0.degree. C. to 800.degree. C. The insulating films are prepared by coating the surface of a substrate the composition; evaporating the solvent; and subsequently heating the substrate in order to generate gas from component (C) during the course of or after the cure of the said resin (A).

Composition and process for forming electrically insulating thin films

To provide a composition for the formation of insulating films that can form an insulating film having a low dielectric constant. The composition comprises (A) an electrically insulating curable resin selected from the group consisting of electrically insulating curable organic resins and electrically insulating curable inorganic resins; and (B) at least two solvents: (B)(i) a solvent capable of dissolving resin (A) and (B)(ii) a solvent whose boiling point or vapor pressure curve differs from that of solvent (B)(i) or whose affinity for resin (A) differs from that of solvent (B)(i). Also claimed is a method for forming a insulating films that have a dielectric constant of less than 2.7.

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Chiba, Japan

Motoshi Sasaki