Asahi Glass Company, Limited

Agc Inc.

Motoshi Ono

Mitsuru Watanabe

Kohei Horiuchi

Mamoru Isobe

Shigetoshi Mori

Osamu Kagaya

Akio Koike

Yasuo Morimoto

Yuki Kondo

Naoki Sugimoto

Nobuhiro Nakamura

Kenji Imakita

Kazutaka Hayashi

Shintaro Takahashi

Toshiki Sayama

Masabumi Ito

Nao Ishibashi

Takeshi Motegi

Hidefumi Odaka

Norihito Nakazawa

Mika Yokoyama

Kanji Arai

Takanori Kobashi

A substrate with a tetrafluoroethylene polymer and an inorganic filler, wherein the proportion of the total volume of the tetrafluoroethylene polymer and the inorganic filler to the total volume of the present substrate is at least 80 vol %, and the substrate has a rate of change in dielectric loss tangent at 10 GHz before and after 72 hours of unsaturated pressure cooker test at 120° C. under 85% RH on a 127-μm thick specimen cut out from the substrate is at most 30%.

Substrate and metal laminate

An antenna includes an antenna conductor to be provided on an exterior side of a chassis and a flexible substrate. The flexible substrate includes a first insulating portion that is a portion of a sheet-shaped dielectric where the sheet-shaped dielectric is folded, a grounding conductor provided between the first insulating portion and the chassis, a second insulating portion that is a portion of the sheet-shaped dielectric where the sheet-shaped dielectric is not folded, and a signal line configured to feed power to the antenna conductor. A thickness of the first insulating portion is greater than a thickness of the second insulating portion.

Antenna

A manufacturing method of a glass substrate having holes includes irradiating a plurality of hole formation target positions of a dummy glass substrate with a laser under a first condition, to form a plurality of holes in the dummy glass substrate; heating the dummy glass substrate under a second condition; measuring, for each of the hole formation target positions, a deviation between the hole formation target position and a position of the hole after the heating formed by irradiating the hole formation target position of the dummy glass substrate; irradiating irradiation target positions of a glass substrate, having substantially same shape, dimension and composition as the dummy glass substrate, with a laser under the first condition, to form a plurality of holes, the irradiation target positions of the glass substrate with the laser being determined taking into account the deviation; and heating the glass substrate under the second condition.

Manufacturing method of glass substrate having holes, manufacturing method of interposer substrate, and method for forming hole in glass substrate

A manufacturing method for a glass substrate having a hole with a depth of d (&#x3bc;m) or more includes irradiating the glass substrate with a laser beam emitted from a COlaser oscillator for an irradiation time t (&#x3bc;sec), to form a hole in the glass substrate. The laser beam is delivered to the glass substrate after being condensed at a focusing lens. A power density P(W/cm), defined bywhere Pand S are a power and a beam cross-sectional area of the laser beam just prior to entering the focusing lens, respectively, is 600 W/cmor less. The irradiation time t (&#x3bc;sec) satisfies&#x2265;10&#xd7;/().

Manufacturing method for glass substrate, method for forming hole in glass substrate, and apparatus for forming hole in glass substrate

A manufacturing method of a glass substrate with a hole having a diameter &#x3d5;, and with a thickness &#x3b8;includes setting a thickness &#x3b8;of a glass plate that is to be processed; preparing a glass plate with the thickness &#x3b8;, having first and second surfaces opposite to each other; forming one initial characteristic object or two or more initial characteristic objects in the glass plate by irradiating the glass plate with a laser from a side of the first surface of the glass plate, the initial characteristic object having a size of a diameter &#x3d5;on the first surface; and performing wet etching for the glass plate having the initial characteristic object, so that from the initial characteristic object a hole having the diameter &#x3d5;on the first surface is formed, and a thickness of the glass plate is adjusted from &#x3b8;to a target value of &#x3b8;.

Manufacturing method of glass substrate with hole

A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 &#x3bc;m or less. Perpendicularity expressed by P=t/tranges from 1.00000 to 1.00015, where P is the perpendicularity, tis the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and tis the thickness of the glass substrate.

Glass substrate

Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.

Method of forming hole in glass substrate by using pulsed laser, and method of producing glass substrate provided with hole

A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.

Glass substrate and glass substrate for high frequency device

Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle &#x3b8; that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2):(/2)/=tan &#x3b8;&#x2003;&#x2003;(1), and0.16&#x2264;sin &#x3b8;&#x2264;0.22&#x2003;&#x2003;(2).

Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole

An apparatus for forming holes in a glass substrate, includes a laser source that irradiates a laser beam on a first surface of the glass substrate, and a base plate on which a second surface of the glass substrate, opposite to the first surface, is placed. The base plate includes a recessed area in a central part thereof, and supports arranged within the recessed area to support the glass substrate. At least a part of the supports is arranged in a lattice shape within a plane approximately perpendicular to a direction in which the supports extend. One support and another adjacent support closest to the one support, amongst the supports arranged in the lattice shape, are arranged at an interval that is shorter than 30 mm, and the supports have a height that is higher than 70 &#x3bc;m.

Apparatus and method for forming holes in glass substrate

A method of manufacturing a glass component includes preparing a glass substrate having a thickness greater than or equal to 300 &#x3bc;m, forming first electric wires on a first surface of the glass substrate, forming a structure by joining the glass substrate via a resin layer to a support substrate such that the first surface of the glass substrate faces the resin layer, thinning the glass substrate from a second surface of the glass substrate to a thickness between 10 &#x3bc;m and 80 &#x3bc;m, forming through holes in the glass substrate by irradiating the glass substrate from the second surface with a laser beam, forming second electric wires on the second surface of the glass substrate such that the second electric wires are electrically connected to the corresponding first electric wires via conductors filling the through holes, and separating the glass substrate from the support substrate.

Method of manufacturing glass component, glass component, and glass interposer

It is an object of the present invention to provide a glass substrate having plural through-holes which is not likely to peel from a silicon wafer, even though laminated on and jointed to a the silicon wafer and then subjected to heat treatment. The above object is accomplished by a glass substrate having an average thermal expansion coefficient of from 10&#xd7;10to 50&#xd7;10/K within a range of from 50&#xb0; C. to 300&#xb0; C., having plural through-holes with a taper angle of from 0.1 to 20&#xb0; and having a thickness of from 0.01 to 5 mm.

Glass substrate for semiconductor device component and process for producing glass substrate for semiconductor device component

To provide a process for producing a glass member provided with a sealing material layer, capable of favorably forming a sealing material layer even in a case where the entire glass substrate cannot be heated. A sealing material paste prepared by mixing a sealing material containing a sealing glass and a laser absorbent with an organic binder is applied to a sealing region of a glass substratein the form of a frame. The frame-form coating layerof the sealing material paste is selectively heated by irradiation with a laser lightalong the coating layerto fire the sealing material while the organic binder in the coating layeris burnt out to form a sealing material layer. Using such a sealing material layer, a space between two glass substrates is sealed.

Process and apparatus for producing glass member provided with sealing material layer and process for producing electronic device

The present invention is intended to provide an organic LED element in which the extraction efficiency is improved up to 80% of emitted light, and provides a translucent substrate comprising a translucent glass substrate; a scattering layer formed on the glass substrate and comprising a glass which contains a base material having a first refractive index for at least one wavelength of light to be transmitted and a plurality of scattering materials dispersed in the base material and having a second refractive index different from that of the base material; and a translucent electrode formed on the scattering layer and having a third refractive index higher than the first refractive index, wherein distribution of the scattering materials in the scattering layer decreases toward the translucent electrode.

Light transmitting substrate, method for manufacturing light transmitting substrate, organic LED element and method for manufacturing organic LED element

The present invention is to provide a method for smoothing the optical surface having a concave defect of an optical component for EUVL. The present invention relates to a method for smoothing the optical surface of an optical component for EUVL, comprising irradiating, with an excimer laser having a wavelength of 250 nm or less with a fluence of 0.5 to 2.0 J/cm, the optical surface having a concave defect of an optical component for EUV lithography (EUVL), the optical component being made of a TiO-containing silica glass material comprising SiOas a main component.

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Chiyoda-ku, Japan

Motoshi Ono