Renesas Electronics Corporation

Renesas Technology Corp.

Motoo Suwa

Takafumi Betsui

Shigezumi Matsui

Yasuhiro Yoshikawa

Norihiko Sugita

Naoto Taoka

Yoshiharu Fukushima

Toru Hayashi

Kazuyuki Sakata

Hisashi Shiota

Satoshi Nakamura

Ryoichi Sano

Takashi Sato

Kazuo Murakami

Kazuaki Tsuchiyama

Tsuyoshi Yaguchi

Kenzo Kuwabara

Hiroshi Toyoshima

Masato Suzuki

Hiroaki Nambu

Yoshinori Miyaki

Ryuichi Oikawa

Akinobu Watanabe

Masahiro Toyama

Takanobu Naruse

Hideshi Fukumoto

Hikaru Ikegami

Yuichi Mabuchi

Hidemasa Takahashi

Kazuhiko Hiranuma

Mitsuya Kinoshita

Toshikazu Matsuda

Improve semiconductor device performance. The wiring WLA on which the semiconductor chip CHPin which the semiconductor lasers LD is formed is mounted has a stub STBin the vicinity of the mounting area of the semiconductor chip CHP

Semiconductor device

A performance of an electronic device is improved. An optical transceiver (electronic device) includes a semiconductor device electrically connected to a transmission line. In this semiconductor device, a resistor is arranged between a wiring electrically connected to the transmission line and a semiconductor chip having a semiconductor laser formed therein.

Electronic device and method of manufacturing the same

A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

Data processing device

To provide an electronic device capable of improving a signal quality, the electronic device includes a semiconductor memory device, a semiconductor device configured to access data stored in the semiconductor memory device, and a wiring substrate on which the semiconductor memory device and the semiconductor device are mounted. The wiring substrate includes first and second data wirings electrically connecting the semiconductor device with each first and second data terminal of the semiconductor memory device through first and second wiring layers. The first wiring layer is a wiring layer arranged closer to the semiconductor device than the second wiring layer, and the first data terminal is located farther from the semiconductor device than the second data terminal.

Synchronous dynamic random access memory (SDRAM) and memory controller device mounted in single system in package (SIP)

An electronic device includes a first wiring substrate and a semiconductor device mounted on the first wiring substrate. A plurality of first semiconductor chips and a second semiconductor chip which controls each of the plurality of first semiconductor chips are mounted side by side on a second wiring substrate of the semiconductor device. Further, the plurality of first semiconductor chips are mounted between a first substrate side of the wiring substrate and an extension line of a first chip side of the second semiconductor chip. Furthermore, the first wiring substrate includes a first power line which supplies a first power potential to each of the plurality of first semiconductor chips and a second power line which supplies a second power potential to the second semiconductor chip and has a width larger than that of the first power line. Also, the second power line intersects the first substrate side of the second wiring substrate and extends from a side of the first substrate side of the second wiring substrate toward the second semiconductor chip when seen in a plan view.

Electronic device and semiconductor device

Provided is a semiconductor device which can be prevented from increasing in size. The semiconductor device includes a semiconductor chip having a first main surface and a second main surface opposite to the first main surface and a wiring substrate over which the semiconductor chip is mounted such that the second main surface of the semiconductor chip faces a first main surface of the wiring substrate. Over the second main surface of the semiconductor chip, a plurality of first terminals connected with a first circuit and a plurality of second terminals connected with a second circuit are arranged. An arrangement pattern of the plurality of first terminals and an arrangement pattern of the plurality of second terminals include the same arrangement pattern. In a region of the wiring substrate where the first circuit is close to the second circuit when viewed from the first main surface of the semiconductor chip, a voltage line which supplies a power supply voltage to the first circuit is formed. In a region of the wiring substrate where the second circuit is close to the first circuit, a voltage line which supplies the power supply voltage to the second circuit is formed.

An electronic device includes a first wiring substrate and a semiconductor device mounted on the first wiring substrate. The semiconductor device includes a second wiring substrate having a plurality of terminals, a plurality of first semiconductor chips mounted on the second wiring substrate, and a second semiconductor chip mounted on the second wiring substrate. The first wiring substrate includes a first power supply line and a second power supply line supplying a plurality of power supply potentials, whose types are different from each other, to the second semiconductor chip. In a plan view, the second power supply line is arranged to cross over a first substrate side of the second wiring substrate and a first chip side of the second semiconductor chip. In a plan view, the first power supply line is arranged to pass between the second power supply line and a part of the plurality of first semiconductor chips and to extend toward a region overlapping with the second semiconductor chip. An area of a region of the first power supply line, the region overlapping with the second power supply line in a thickness direction, is smaller than an area of another region of the first power supply line, the another region not overlapping with the second power supply line.

Electronic device

An electronic device includes a substrate including an upper surface, a clock output pad formed in a control device mounting area of the upper surface, a command/address output pad formed in the control device mounting area, a clock signal main wiring connected to the clock output pad, a command/address signal main wiring connected to the command/address output pad, a first clock signal branch wiring branched from the clock signal main wiring at a first branch point of the clock signal main wiring, and a second clock signal branch wiring branched from the clock signal main wiring at a second branch point of the clock signal main wiring, which is located at a downstream side of the clock signal main wiring than the first branch point of the clock signal main wiring.

An electronic device includes a mounting substrate, a first semiconductor component including a first semiconductor chip that operates in synchronization with a first clock signal and being mounted on a first semiconductor component mounting area of the mounting substrate, a second semiconductor component including a second semiconductor chip that operates in synchronization with a second clock signal and being mounted on a second semiconductor component mounting area of the mounting substrate, the second semiconductor component mounting area being next to the first semiconductor component mounting area, and a third semiconductor component including a third semiconductor chip that controls the first and second semiconductor chips and being mounted on a third semiconductor component mounting area of the mounting substrate, the third semiconductor component mounting area being next to the first and the second semiconductor component mounting areas.

The number of terminals included in a semiconductor device which is included in an electronic device is reduced. The electronic device includes: a first semiconductor device having first and second input terminals; a second semiconductor device having a first output terminal and a first driver circuit to drive the first output terminal; and a wiring substrate over which the first and second semiconductor devices are mounted. The first and second input terminals are commonly coupled to the first output terminal via a first line formed on the wiring substrate. A composite resistance value of first and second termination resistors coupled to the first and second input terminals, respectively, is equivalent to a drive impedance of the first driver circuit.

Growing community of inventors

Tokyo, Japan

Motoo Suwa