Sharp Kabushiki Kaisha Corporation

Motonari Aki

Taiji Maeda

Yoshiki Yasuda

A multichannel monolithic chip that has a number of photo-couplers provided on a single silicon substrate is mounted on an insulating substrate, a first cut groove is formed by dicing between a light-emitting element and a light-receiving element that constitute a photo-coupler, a transparent insulating resin is filled into the first cut groove and then a second cut groove is formed by dicing between the adjacent photo-couplers, each of the light-emitting element and the light-receiving element is electrically connected to an external terminal using a bonding wire, and the entirety of the insulating substrate is molded with a light-blocking resin.

Method for manufacturing optocoupler

An optical semiconductor element includes a light-emitting element, a light-receiving element that is placed opposite to the light-emitting element, and two lead frames on which the light-emitting element and the light-receiving element are respectively die bonded. Shield plates are bent respectively toward the light-emitting element or the light-receiving element at a predetermined angle with respect to the surface of a die bonding region on the periphery of the die bonding region of the lead frames.

Shielding leadframe for semiconductors for optical coupling and electronic apparatus including same

A semiconductor light receiving device is provided, which comprises a semiconductor substrate, a collector region, a base region, and an emitter region, an insulating film covering the surface of the collector region, the base region, and the emitter region, a first metal line on the insulating film at a position corresponding to the base region and being electrically connected to the emitter region, and a second metal line on the insulating film at a position corresponding to a junction portion of the base region and the collector region and being electrically connected to the emitter region. The first metal line has a sloped surface such that incident light falling on the first metal line is reflected and directed toward the surface of the base region.

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Nara, Japan

Motonari Aki