The Furukawa Electric Co., Ltd.

Furukawa Automotive Systems Inc.

Tamura Fa System Corporation

Tamura Furukawa Machinery Corporation

Motomu Shibamura

Atsushi Tanaka

Kyosuke Hashimoto

Tomoaki Toratani

Motohiro Yamane

Kyutaro Abe

Toshitaka Hara

Kouichi Miyazaki

A substrate () includes conductive portions () formed by press working and a resin portion () integrally injection-molded with the conductive portions (). The conductive portions () are formed from, for example, a copper alloy. The resin portionis formed from, for example, PPS. A surface-mount component (), which is an electronic surface-mount component, is mounted on the substrate (). The surface-mount component () has electrodes () at its opposite sides, and the electrodes () and the respective conductive portions () are electrically connected by means of a solder (). The substrate () has a hole (), which functions as a stress relaxation mechanism, formed in the resin portion () (a portion extending therethrough) between connection portions () under the surface-mount component (). The substrate () also has resin-exposed portions (), which function as a stress relaxation mechanism, formed on opposite sides of the surface-mount component ().

Assembly structure for injection molded substrate and for mounting component

In the first buffering area provided between the inlet of the furnace and the heating chamber, the ambient gas is blown to the printed circuit board from the lower side of the carrier device, while the ambient gas is sucked in the upper side of the carrier device, thus the outside air is prevented from infiltrating and the ambient gas is prevented from flowing out. Furthermore, the flux is prevented from being attached to the printed circuit board, by installing the flux dropping prevention mechanism in the suction port of the ambient gas.

Reflow furnace

Reflow Furnace

Growing community of inventors

Tokyo, Japan

Motomu Shibamura