Resonac Corporation

Showa Denko Materials Co., Ltd.

Motoki Yonekura

Yoshinori Ejiri

Hideo Nakako

Yuki Kawana

Shinichirou Sukata

Takaaki Nohdoh

Hiroshi Masuda

Keita Sone

Masaya Toba

Manabu Ishii

Ryuji Akebi

Yoshiaki Kurihara

Kohsuke Urashima

Masaru Fujita

Kosuke Urashima

Michiko Natori

Ryo Honna

An aspect of the invention is a method for producing a substrate having through-silicon vias, the method including a preparation step of preparing a silicon substrate provided with through-holes, in which the through-holes communicate with both principal surfaces; a copper sintered body formation step of forming a copper sintered body having a porous structure such that the copper sintered body fills at least the through-holes; a resin impregnation step of impregnating the copper sintered body with a curable resin composition; and a resin curing step of curing the curable resin composition impregnated into the copper sintered body to form an electric conductor that includes the copper sintered body having pores filled with a resin cured product, and providing through-silicon vias in the through-holes.

Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation

One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.

Electronic component and method for manufacturing electronic component

Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20&#xb0; C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20&#xb0; C. of 0.5 Pa or more and less than 200 Pa.

Composition containing organic solvents with different vapor pressures, conductor made from composition, method for manufacturing conductor, and structure comprising conductor

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Tokyo, Japan

Motoki Yonekura