Kokusan Denki Co., Ltd.

Motoki Yamazaki

Shuichi Muramatsu

Hidetoshi Suzuki

Hirofumi Yamaguchi

Masaki Asari

Tomoyuki Sato

Kazuo Hara

A semiconductor device having a plurality of semiconductor chips mounted on a lead frame () and required portions covered with seal portions in which: the plurality of semiconductor chips are divided into a first group of semiconductor chips (Dx to Dz) and a second group of semiconductor chips (Du to Dw and Thx to Thz); both groups of semiconductor chips are mounted on the lead frame () at a distance from each other; the seal portions are comprised of first and second resin-seal portions (and) which cover the first and second groups of semiconductor chips, respectively, along with required portions of the lead frame; both resin-seal portions are mechanically coupled with each other by coupling portions; and a group of read terminals respectively connected to circuits within the first resin-seal portion and circuits within the second resin-seal portion are led out through a gap between the first resin-seal portion () and the second resin-seal portion ().

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Numazu, Japan

Motoki Yamazaki