Tokyo Ohka Kogyo Co., Ltd.

Skhynix Inc.

Central Japan Railway Company

Motoki Takahashi

Toshiro Morita

Toshiyuki Ogata

Takashi Kamizono

Takaaki Hirai

Takahiro Asai

Koichi Misumi

Hirofumi Imai

Tomoya Kumagai

Katsuya Tanitsu

Tetsuya Shichi

Akimasa Nakamura

Hiroyuki Iida

Atsushi Murota

Christopher Cordonier

Teruhiro Uematsu

Masaharu Nakamura

Jun Kyoung Lee

Kyung Hee Oh

The present disclosure relates to a thinner composition for removing a resist and a processing method of a semiconductor substrate using the thinner composition. Particularly, the thinner composition includes (a) propylene glycol monoalkyl ether, (b) propylene glycol monoalkyl ether acetate, (c) cyclohexanone, and (d) cyclopentanone. In addition, the processing method of a semiconductor substrate includes applying a resist composition on a semiconductor substrate and removing the applied resist composition using the thinner composition of the present invention.

Thinner composition and method of processing surfaces of semiconductor substrates

A solution including an organic solvent (S), and an antioxidant (A), in which an antioxidant (A) includes a tocopherol compound (A1).

Solution, method of forming resist pattern, and semiconductor device manufacturing method

A method of diffusing an impurity-diffusing component including forming a first diffusing agent layer containing a first conductivity type impurity-diffusing component on the surface of a semiconductor substrate; calcining the first diffusing agent layer; forming a second diffusing agent layer containing a second conductivity type impurity-diffusing component on the surface of the semiconductor substrate excluding the region where the first diffusing agent layer is formed; and heating the semiconductor substrate at a temperature higher than the calcination temperature to diffuse the first and second conductivity type impurity-diffusing components to the semiconductor substrate.

Method of diffusing impurity-diffusing component and method of manufacturing solar cell

An adhesive composition is disclosed which includes a polymer prepared by copolymerizing a monomer containing a polymerizable group, the polymer including a low-molecular-weight component having a molecular weight equivalent to 1% or less of the weight-average molecular weight of the polymer, the low-molecular-weight component is contained in a range of not less than 0 weight % to less than 0.3 weight % of the total weight of the polymer. This allows provision of an adhesive composition having great adhesive strength in a high-temperature environment, especially at temperatures from 140&#xb0; C. to 200&#xb0; C., as well as high heat resistance and favorable crack resistance.

Adhesive composition, film adhesive, and method for producing the adhesive composition

An embodiment of the present invention relates to a diffusing agent composition used in printing an impurity-diffusing component onto a semiconductor substrate, wherein the diffusing agent composition contains: a hydrolysis product of alkoxysilane (A); a component (B) containing at least one selected from the group consisting of a hydrolysis product of alkoxy titanium, a hydrolysis product of alkoxy zirconium, titania fine particle, and zirconia fine particle; an impurity-diffusing component (C); and an organic solvent (D).

Diffusing agent composition, method of forming impurity diffusion layer, and solar battery

Disclosed is a positive-type photosensitive composition which can form a metal compound film pattern at high resolution and with less affection by organic residues. The positive-type photosensitive composition comprises: a metal complex component (A) which can form a metal compound film when applied and subsequently fired; and a photosensitizing agent (B). In the composition, a ligand in the component (A) is preferably a multidentate ligand having an aromatic compound as its skeleton. According to this construction, even a composition containing substantially no photosensitive resin can impart photosensitivity and a metal compound film pattern can be formed readily.

Positive-type photosensitive composition

A mask material composition that is used for diffusion barrier of an impurity diffusing component into a semiconductor substrate includes a siloxane resin (A1) containing a constituent unit represented by the following formula (a1): wherein Ris a single bond or C-Calkylene group; and Ris a C-Caryl group.

Mask material composition, method of forming impurity diffusion layer, and solar battery

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Kawasaki, Japan

Motoki Takahashi