Denso Corporation

Motoki Shimizu

Yasuhiro Tanaka

Toshihisa Taniguchi

Atusi Sakaida

Yoshihiko Shiraishi

Toshikazu Harada

Norio Gouko

Yoshitaro Yazaki

Satoshi Takeuchi

Keita Saitou

Eijirou Miyagawa

Hiroki Kamiya

Katsunori Kubota

A heat flux sensor is installed in such a way that heat flux emanating from a biological object present at a predetermined position is detectable. It is determined whether or not a biological object is present at the predetermined position by comparing sensing results of the heat flux sensor with determination criteria. The determination criteria is preset according to heat flux that can be sensed when a biological object is present at the predetermined position. When the sensing results of the heat flux sensor satisfy the determination criteria, in other words, when the heat flux sensed by the heat flux sensor is the heat flux emanating from a biological object, it is determined that a biological object is present at the predetermined position. Consequently, it is possible to realize accurate detection of a biological object.

Biological object detector, vehicle seat occupancy detector, and seat belt non-wearing warning system

A heat quantity control device has a heat flux sensor arranged between first and second heating elements arranged adjacently to each other, and a control section for controlling a heat quantity of the first and second heating elements. The heat flux sensor has an insulation board made of thermoplastic resin, first and second via holes formed in the insulation board penetrating in a thickness direction thereof. First and second layer connection members are embedded in the first and second via holes, respectively. The first and second layer connection members are made of different metals and alternately connected in series. The control section controls a heat quantity generated in the first and second heating elements based on the electromotive force generated in the heat flux sensors so that a heat flux flowing between the first and second heating elements becomes not more than a predetermined value.

Heat quantity control device

There is provided a heat flux sensor with first and second interlayer connection members composed of different metals from each other of which metal atoms maintain a predetermined crystal structure embedded in first and second via holes of a thermoplastic resin made insulating substrate, the first and the second interlayer connection members are connected in series alternately, and a control unit that performs abnormality determination of a heating element disposed in a vehicle. The heat flux sensor is provided to the heating element and outputs a sensor signal corresponding to heat flux between the heating element and an outside air, and the control unit determines based on the sensor signal that there is abnormality in the heating element when the heat flux between the heating element and the outside air is out of a predetermined range.

Abnormality determination apparatus for vehicle

A component-embedded board device has a wiring board in which an electronic component is embedded, a connection member which is conductive and arranged at a surface of the wiring board, and an inner wiring unit which is arranged in the wiring board and connects an electrode of the electronic component with the connection member. The component-embedded board device is further provided with an inspection connection member for an inspection of a faulty wiring of the inner wiring unit, and an inspection wiring unit which is arranged in the wiring board and connects the inspection connection member with one of the electrode and a predetermined portion of the inner wiring unit. The inspection connection member is conductive and arranged at a surface of the wiring board.

Component-embedded board device and faulty wiring detecting method for the same

A multilayer substrate includes an insulating base member having a plurality of resin films, an electric element embedded in the insulating base member, and a spacer. The resin films are made of a thermoplastic resin and stacked and attached to each other. At least one resin film has a through hole for inserting the electric element. The one resin film further has a plurality of protruding members. One protruding member opposes to another one protruding member so that the one and the another one contact and sandwich the electric element. The spacer is arranged between the one resin film and an adjacent resin film and is disposed at a base portion of one of the protruding members.

Multilayer substrate and method of manufacturing the same

Two types of resin films are prepared for manufacturing a multi-layer board containing a chip component. A fist type has a via hole for the chip component to be inserted into, while a second type does not have the via hole. Resin films including the two types are piled before the chip component is inserted. At least a given resin film of the first type has a via hole provided with protruding members. Of the protruding members, opposing protruding members form a gap between their tips. This gap is shorter than an outer dimension of the inserted chip component. The chip component crushes portion of the tips of the protruding members while being pressed and inserted into the via hole in the given resin film.

Growing community of inventors

Kariya, Japan

Motoki Shimizu