Ngk Spark Plug Company, Limited

Motoki Hotta

Takamichi Ogawa

Kohei Mitsuya

Hideo Tange

A first ceramic member and a second ceramic member are joined together at a lower joining temperature while reducing the loss of bond strength. A method for producing a semiconductor production device component includes a step of providing a first ceramic member including an AlN-based material, a step of providing a second ceramic member including an AlN-based material, and a step of joining the first ceramic member and the second ceramic member to each other by thermally pressing the first ceramic member and the second ceramic member to each other via a joint agent including EuO, GdOand AlOdisposed between the first ceramic member and the second ceramic member.

Method for producing semiconductor production device component, and semiconductor production device component

A semiconductor production device component includes a first ceramic member including an AlN-based material, a second ceramic member including an AlN-based material, and a joint layer disposed between the first ceramic member and the second ceramic member so as to join the first ceramic member and the second ceramic member to each other. The joint layer includes a composite oxide containing Gd and Al, and AlO, and is free from AlN.

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Kasugai, Japan

Motoki Hotta