Toyota Jidosha Kabushiki Kaisha

Nichia Corporation

Kabushiki Kaisha Toyota Chuo Kenkyusho

Aisin Aw Co., Ltd.

Motoki Hiraoka

Yuki Sato

Hiroshi Yanagimoto

Masaaki Ito

Daisuke Ichigozaki

Keiu Kanada

Hisashi Maehara

Reimi Tabuchi

Noritaka Miyamoto

Tetsuya Shoji

Naoki Hasegawa

Kazuaki Haga

Hirofumi Iisaka

Takeshi Bessho

Fusayoshi Miura

Shinya Omura

Yuji Kaneko

Atsushi Murase

Yukio Takada

Hiroki Usui

Akira Yamashita

Takuya Kadoguchi

Noritsugu Sakuma

Takuya Nomura

Akira Manabe

Hisaaki Takao

Michiya Kume

Fumitaka Yoshinaga

Tsuyoshi Miyaji

Setsuto Daiza

Kyoko Nakamura

Shinya Nagashima

Kensuke Akamatsu

Daichi Maruyama

Mitsutoshi Akita

Reimi Sakaguchi

Hisamitsu Toshida

Hiroaki Wakimoto

Naomi Inoue

Sigeru Sibata

Masanori Okanan

Yoshitaka Shimmei

Yoshitaka Shinmei

Takayasu Yoshioka

A Sm—Fe—N-based rare earth magnet more resistant to demagnetization than ever before, particularly at high temperatures, and a production method thereof are provided. The present disclosure presents a production method of a rare earth magnet, including mixing a SmFeN magnetic powder and a modifier powder to obtain a mixed powder, compression-molding the mixed powder in a magnetic field to obtain a magnetic-field molded body, pressure-sintering the magnetic-field molded body to obtain a sintered body, and heat-treating the sintered body, and a rare earth magnet obtained by the method. Dof the magnetic powder is 1.50 μm or more and 3.00 μm or less, the content ratio of the zinc component in the modifier powder is 6 mass % or more and 30 mass % or less, and the heat treatment temperature is 350° C. or more and 410° C. or less.

Rare earth magnet and production method thereof

A Sm—Fe—N-based rare earth magnet more resistant to demagnetization than ever before in an environment where an external magnetic field is applied, particularly at high temperatures, and a production method thereof are provided. The present disclosure presents a production method of a rare earth magnet, including preparing a coated magnetic powder, compression-molding the coated magnetic powder in a magnetic field to obtain a magnetic-field molded body, pressure-sintering the magnetic-field molded body to obtain a sintered body, and heat-treating the sintered body, and a rare earth magnet obtained by the method. Dof the magnetic powder in the coated magnetic powder is 1.50 μm or more and 3.00 μm or less, the content ratio of the zinc component in the coated magnetic powder is 3 mass % or more and 15 mass % or less, and the heat treatment temperature is 350° C. or more and 410° C. or less.

The present invention is a method for producing a rare earth magnet, including preparing a magnetic powder and a modifier powder, mixing them to obtain a mixed powder, compression-molding the mixed powder in a magnetic field to obtain a magnetic-field molded body, and pressure-sintering the magnetic-field molded body to obtain a sintered body, wherein the magnetic powder includes a first particle group and a second particle group, the Dvalues of the first particle group and the second particle group are denoted by dμm and dμm, respectively, dand dsatisfy the relationship of 0.350≤d/d≤0.500, and the ratio between the total volume of the first particle group and the total volume of the second particle group is from 9:1 to 4:1; and a rare earth magnet obtained by the production method.

The method for manufacturing the Halbach magnet array includes the steps of: (a) magnetizing at least two first magnetic material pieces in a direction parallel to a first direction, and (b) magnetizing at least one second magnetic material piece in a direction parallel to a second direction perpendicular to the first direction, in this order. In the step (a), the first magnetic material pieces and the second magnetic material piece are alternately arranged in the second direction with the first magnetic material pieces being each adhered to the adjacent second magnetic material piece, and the magnetization is performed under a condition in which a residual magnetization ratio rof the first magnetic material pieces is higher than a residual magnetization ratio rof the second magnetic material piece.

Method for manufacturing Halbach magnet array

A rotating electrical machine capable of obtaining a higher torque while limiting the amount of permanent magnets used. A magnetic pole of a rotor includes an auxiliary magnet embedded in a rotor core and at least one main magnet arranged on an outer circumferential side than the auxiliary magnet of the rotor. In each magnetic pole, the distance from an end of the main magnet, the end facing the auxiliary magnet, to the auxiliary magnet facing the main magnet is shorter than the length of the main magnet in the radial direction. In a cross-section orthogonal to the rotation axis of the rotating electrical machine, the main magnets of each magnetic pole are arranged so as to be asymmetrical about a virtual line passing the rotation axis and axisymmetrically dividing the auxiliary magnet.

Rotating electrical machine

A manufacturing method of a core for a rotary electric machine, the method includes inserting a permanent magnet that is not yet magnetized in a magnet insertion hole that is formed in a rotor core; injecting a magnet fixing material in the magnet insertion hole; curing the magnet fixing material by heating the rotor core and the permanent magnet; and magnetizing the permanent magnet before a temperature of the rotor core and the permanent magnet decreases to a normal temperature, after the curing of the magnet fixing material.

Manufacturing method of rotor for rotary electric machine

A film deposition device (A) of a metal film (F) includes a positive electrode (), a solid electrolyte membrane (), and a power supply part () that applies a voltage between the positive electrode () and a base material (B) to be a negative electrode. The solid electrolyte membrane () allows a water content to be 15% by mass or more and is capable of containing a metal ion. The power supply part () applies a voltage between the positive electrode and the base material in a state where the solid electrolyte membrane is disposed on a surface of the positive electrode such that metal made of metal ions contained inside the solid electrolyte membrane () is precipitated on a surface of the base material (B).

Film deposition device of metal film and metal film deposition method

In a film forming method, in a state where a metal solution is sealed in a first accommodation chamber of a housing with a solid electrolyte membrane and a fluid is sealed in a second accommodation chamber of a placing table with a thin film, a substrate is placed on the placing table and the placing table and the housing are moved relative to each other to cause the substrate to be interposed between the solid electrolyte membrane and the thin film, the solid electrolyte membrane and the thin film are pressed against the substrate interposed therebetween to cause the solid electrolyte membrane and the thin film to conform to a surface and a rear surface of the substrate, thereby forming a metal film.

Film forming method for metal film and film forming apparatus therefor

A nickel solution for forming a film that can suppress generation of hydrogen gas between a solid electrolyte membrane and a substrate while the solid electrolyte membrane and the substrate are brought into contact with each other. The pH of the nickel solution for forming a film is in the range of 4.2 to 6.1. The nickel solution for forming a film further contains a pH buffer solution that has a buffer function in the range of the pH and does not form insoluble salts or complexes with the nickel ions during formation of the film.

Nickel solution for forming film and film-forming method using same

A method of forming a metal coating includes: disposing a solid electrolyte membrane () between an anode () and a substrate (B) which forms a cathode; bringing a solution (L) containing metal ions into contact with an anode-side portion of the solid electrolyte membrane (); and causing, in a state where the solid electrolyte membrane () is in contact with the substrate (B), a current to flow from the anode () to the cathode so as to form a metal coating formed of the metal on the surface of the substrate (B). The metal coating is formed by repeating a current-flowing period (T) in which a current flows from the anode () to the cathode and a non-current-flowing period (N) in which a current does not flow between the anode () and the cathode.

Method of forming metal coating

Provided is a rare-earth magnet containing no heavy rare-earth metals such as Dy or Tb in a grain boundary phase, has a modifying alloy for increasing coercivity (in particular, coercivity under a high-temperature atmosphere) infiltrated thereinto at lower temperature than in the conventional rare-earth magnets, has high coercivity, and has relatively high magnetizability, and a production method therefor. The rare-earth magnet RM includes a RE-Fe&#x2014;B-based main phase MP with a nanocrystalline structure (where RE is at least one of Nd or Pr) and a grain boundary phase BP around the main phase, the grain boundary phase containing a RE-X alloy (where X is a metallic element other than heavy rare-earth elements). Crystal grains of the main phase MP are oriented along the anisotropy axis, and each crystal grain of the main phase, when viewed from a direction perpendicular to the anisotropy axis, has a plane that is quadrilateral in shape or has a close shape thereto.

Rare-earth magnet and method for producing the same

A method of forming a wiring pattern includes: a) forming a metal underlayer including a first underlying wiring layer which is in contact with an electrode, a second underlying wiring layer which is not in contact with the electrode, and an underlying connection layer which connects the first underlying wiring layer to the second underlying wiring layer; b) forming a metal plating layer on the metal underlayer through electroplating; and c) removing a metal connection portion through etching. The metal connection portion is the underlying connection layer covered with the metal plating layer. The etching includes bringing a solid electrolyte material that contains a solution into which metal of the metal connection portion is dissolved, into contact with the metal connection portion and applying a voltage between the metal connection portion and the solid electrolyte material.

Method of forming wiring pattern and etching apparatus for forming wiring pattern

A coating forming device for forming a metal coating on a surface of a substrate includes: an anode; a power supply; and a solid electrolyte membrane disposed between the anode and the substrate and contains metal ions. The solid electrolyte membrane includes: a contact surface that is a region contacting a coating-forming region where the metal coating is formed; and a concave portion recessed relative to the contact surface such that, when the contact surface contacts the coating-forming region, the solid electrolyte membrane is not in contact with a portion of the surface of the substrate excluding the coating-forming region. The metal ions are reduced to form the metal coating on the coating-forming region by the power supply applying a voltage between the anode and the substrate.

Coating forming device and coating forming method for forming metal coating

A metal-film forming apparatus includes: an anode; a resin substrate having a surface on which a conductor pattern layer that serves as a cathode is formed; a solid electrolyte membrane that contains metal ions and is between the anode and the resin substrate, the solid electrolyte membrane contacting a surface of the conductor pattern layer when a metal film is formed; a power supply; and a conductive member that is arranged contacting the conductor pattern layer when the metal film is formed, such that a negative electrode of the power supply is electrically connected to the conductor pattern layer, the conductive member being detachable from the conductor pattern layer, wherein the metal ions are reduced to deposit metal that forms the metal film on the surface of the conductor pattern layer when the voltage is applied.

Metal-film forming apparatus and metal-film forming method

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Toyota, Japan

Motoki Hiraoka