Kabushiki Kaisha Toshiba

Motojiro Shibata

Yukihiro Ikeya

Yusuke Mitsuya

Tetsuya Kubo

Akira Ushijima

Toshikazu Taki

Hiroaki Fujihara

Takeshi Toyoshima

According to one embodiment, a holding device includes a first holder configured to hold an upper surface of an article, and a second holder configured to hold a side surface of the article. The holding device performs at least a first operation of the first and second holders holding the article, and a second operation of only the first holder holding the article.

Holding device, cargo handling apparatus, and holding method

A semiconductor-chip exfoliating device for exfoliating a semiconductor chipfrom an adhesive sheetis provided. The device includes a backup holderfor holding the adhesive sheetso that semiconductor chipsturn upward, a pair of needle pins arranged on a backside of the holderto lift off the adhesive sheetfrom the holderthrough through-holesin the holderand a sliding unitarranged on the backside of the holderto slide one needle pinin a direction to depart from the other needle pin. By the sliding unit, the interval between the needle pinscan be changed so as to cope with a variation of semiconductor chipsA.

Semiconductor-chip exfoliating device and semiconductor-device manufacturing method

A method of bonding a semiconductor chip, including step of photographing a surface of a semiconductor chip, on which an electrode is formed, and detecting a relative position of the electrode with respect to the semiconductor chip, a bonding step of making the electrode of the semiconductor chip to face a circuit pattern provided on a substrate, and bonding the electrode to the circuit pattern, a step of photographing the substrate on which the semiconductor chip is formed, and detecting a relative position of the semiconductor chip with respect to the substrate. Also included is a step of evaluating a bonding accuracy by calculating a relative position of the electrode with respect to the substrate from the relative position of the semiconductor chip with respect to the substrate and the relative position of the electrode with respect to the semiconductor chip.

Method for bonding semiconductor chip and device therefor

Growing community of inventors

Yokohama, Japan

Motojiro Shibata